SCHEMBL1307986

SCHEMBL1307986

C(OCC1CO1)C1CO1.C=C(CCCCO)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
TSHR P16473 2/20 0.39
SMN1; SMN2 Q16637 1/20 0.35
MGLL Q99685 3/20 0.34
TDP1 Q9NUW8 1/20 0.33
GPR84 Q9NQS5 1/20 0.33
FFAR1 O14842 1/20 0.33
FFAR4 Q5NUL3 1/20 0.33
TP53 P04637 1/20 0.33
CYP3A4 P08684 1/20 0.33
MAPK1 P28482 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16319601 0.98 ALDH1A1 (0.38) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL984292 0.86 TSHR (0.58) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL985818 0.84 TSHR (0.56) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL17063040 0.84 TSHR (0.56) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
Methacrylic Acid SCHEMBL27547181 0.84 ALDH1A1 (0.53) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL985178 0.84 TSHR (0.55) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
1,4-Butanediol SCHEMBL17603250 0.83 TSHR (0.50) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
1,6-Hexanediol SCHEMBL27424414 0.83 ALDH1A1 (0.51) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL15949765 0.81 TSHR (0.52) ALDH1A1TSHRSMN1; SMN2MGLLTDP1
SCHEMBL3611978 0.80 TSHR (0.48) ALDH1A1TSHRSMN1; SMN2MGLLTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 301 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111909491-B Photo-sensitive composite resin for photo-curing 3D printing and preparation method thereof 广东工业大学 2023-02-07 CN claimed
CN-115569536-A Anti-pollution ultrafiltration membrane and preparation method and application thereof 浙江大学 2023-01-06 CN claimed
CN-113004455-B Macromolecular anionic-nonionic emulsifier and preparation method thereof 扬州工业职业技术学院 2022-05-27 CN claimed
CN-110172228-B Lignin epoxy resin/carbon fiber reinforced anti-aging composite material 山西舜质新材料科技有限公司 2021-08-03 CN claimed
CN-113004455-A Macromolecular anionic-nonionic emulsifier and preparation method thereof 扬州工业职业技术学院 2021-06-22 CN claimed
CN-112745235-A Cardanol modification method, modified cardanol, photoresist and application of photoresist 阜阳欣奕华材料科技有限公司 2021-05-04 CN claimed
CN-112534006-A Production of decorated leather 爱克发有限公司 2021-03-19 CN claimed
CN-111909491-A Photosensitive composite resin for photocuring 3D printing and preparation method thereof 广东工业大学 2020-11-10 CN claimed
CN-111298190-A Hemostatic material for infants and preparation method thereof 杨晓菲 2020-06-19 CN claimed
CN-111253609-A Method for preparing modified polymer membrane material, material obtained by method and application of material 中国科学院上海应用物理研究所 2020-06-09 CN claimed
EP-2109881-B1 SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL HENKEL AG & CO KGAA (DE) 2018-09-26 EP claimed
CN-104449484-A Pressure-sensitive adhesive, conductive adhesive composition and adhesive tape prepared from same and application of composition 3M INNOVATIVE PROPERTIES CO 2015-03-25 CN claimed
US-8212369-B2 Semiconductor wafer coated with a filled, spin-coatable material HENKEL AG & CO. KGAA (DE) 2012-07-03 US claimed
US-20100193973-A1 SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL HENKEL AG & CO. KGAA (DE) 2010-08-05 US claimed
JP-2010517316-A 2010-05-20 JP claimed
EP-2109881-A1 SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL Henkel AG & Co. KGaA (DE) 2009-10-21 EP claimed
WO-2008094149-A1 SEMICONDUCTOR WAFTER COATED WITH A FILLED, SPIN-COATABLE MATERIAL HENKEL AG & CO. KGAA (DE) 2008-08-07 WO claimed
US-20240227256-A1 THERMOSETTING COMPOSITION FOR INJECTION MOLDING, METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME, AND CURED PRODUCT IDEMITSU KOSAN CO.,LTD. (JP) 2024-07-11 US disclosed
WO-2005047346-A1 CURABLE POLYMER COMPOUND SHOWA DENKO K.K. (JP) 2005-05-26 WO disclosed
WO-2003095506-A1 RADIATION CURABLE COMPOSITIONS UCB, S.A. (BE) 2003-11-20 WO disclosed