⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13109265 | 0.89 | — | — | |
| SCHEMBL14556472 | 0.82 | — | — | |
| SCHEMBL10301344 | 0.81 | — | — | |
| SCHEMBL13109255 | 0.72 | ALDH1A1 (0.30) | — | |
| SCHEMBL13889169 | 0.68 | — | — | |
| SCHEMBL13628678 | 0.66 | — | — | |
| SCHEMBL14066964 | 0.65 | — | — | |
| SCHEMBL22545711 | 0.62 | — | — | |
| SCHEMBL670061 | 0.61 | — | — | |
| Bromide SCHEMBL22501336 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7799843-B2 | Film | FUJIFILM CORPORATION (JP) | 2010-09-21 | — | — | US | disclosed |
| US-20090227736-A1 | COMPOSITION FOR FORMING A FILM, INSULATING FILM OBTAINED FROM THE COMPOSITION, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2009-09-10 | — | — | US | disclosed |
| US-20090221778-A1 | insulating film; mechanical strength; semiconductors; uniform thickness; film formed by irradiating a silsesquioxane compound with microwaves having a frequency of 5.8 GHz; shorter treatment times and lower temperature; also a hydrocarbon cage compound polymer (adamantane) | FUJIFILM COPORATION (JP) | 2009-09-03 | — | — | US | disclosed |
| US-20090221779-A1 | FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2009-09-03 | — | — | US | disclosed |
| US-7569649-B2 | Film forming composition, insulating film, and electronic device | FUJIFILM CORPORATION (JP) | 2009-08-04 | — | — | US | disclosed |
| US-7534292-B2 | Film-forming composition, insulating film obtained from the composition and electronic device having the same | FUJIFILM CORPORATION (JP) | 2009-05-19 | — | — | US | disclosed |
| US-7501185-B2 | Film-forming composition, insulating material-forming composition, insulating film and electronic device | FUJIFILM CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20090048421-A1 | FILM FORMING COMPOSITION, FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-19 | — | — | US | disclosed |
| US-20080227943-A1 | METHOD OF STORING COATING SOLUTION FOR FORMING INTERLAYER INSULATING FILM FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080161521-A1 | PRODUCTION METHOD OF INSULATING FILM FORMING COMPOSITION, INSULATING FILM FORMING COMPOSITION PRODUCED BY THE PRODUCTION METHOD, INSULATING FILM AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-07-03 | — | — | US | disclosed |
| US-20080161532-A1 | COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-07-03 | — | — | US | disclosed |
| US-20080081131-A1 | INSULATING FILM FORMATION PROCESS | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| US-20080076850-A1 | PRODUCTION METHOD OF INSULATING FILM, INSULATING FILM, STACKED PRODUCT AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076888-A1 | FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076889-A1 | FILM FORMING COMPOSITION, FILM AND INSULATING FILM FORMED FROM THE COMPOSITION, AND ELECTRONIC DEVICE HAVING THE INSULATING FILM | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20070246684-A1 | Film forming composition | FUJIFILM CORPORATION (JP) | 2007-10-25 | — | — | US | disclosed |
| US-20070224436-A1 | Film forming composition | FUJIFILM CORPORATION (JP) | 2007-09-27 | — | — | US | disclosed |
| US-20070135585-A1 | Film forming composition, insulating film using the composition, and electronic device having the insulating film | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |