Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 2/20 | 0.50 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.47 |
| ▸ | NAAA | Q02083 | 2/20 | 0.46 |
| ▸ | HTT | P42858 | 3/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.40 |
| ▸ | FKBP1A | P62942 | 4/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | HMGCR | P04035 | 1/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | CCR2 | P41597 | 1/20 | 0.36 |
| ▸ | CHRM3 | P20309 | 2/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3434643 | 1.00 | EPHX1 (0.50) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL20388945 | 1.00 | EPHX1 (0.50) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL108478 | 1.00 | EPHX1 (0.50) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL132134 | 0.98 | EPHX1 (0.47) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL3435204 | 0.94 | EPHX1 (0.43) | EPHX1CYP19A1NAAAHTTFKBP1A | |
| SCHEMBL3434648 | 0.90 | EPHX1 (0.37) | EPHX1CYP19A1NAAAHTTFKBP1A | |
| SCHEMBL17752194 | 0.88 | EPHX1 (0.44) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL18253353 | 0.87 | EPHX1 (0.41) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL18253457 | 0.86 | CYP2C19 (0.44) | EPHX1CYP19A1NAAAHTTCYP2C19 | |
| SCHEMBL18253461 | 0.85 | CYP2C19 (0.50) | EPHX1CYP19A1NAAAHTTCYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9551931-B2 | Method of forming pattern, actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, process for manufacturing electronic device and electronic device | FUJIFILM CORPORATION (JP) | 2017-01-24 | — | — | US | disclosed |
| US-9383645-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, manufacturing method of electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2016-07-05 | — | — | US | disclosed |
| US-9250519-B2 | Pattern forming method and actinic ray-sensitive or radiation-sensitive resin composition for use in the method | FUJIFILM CORPORATION (JP) | 2016-02-02 | — | — | US | disclosed |
| US-20160004157-A1 | METHOD OF FORMING PATTERN, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, PROCESS FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-01-07 | — | — | US | disclosed |
| US-20150160552-A1 | Photoresist and Method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2015-06-11 | — | — | US | disclosed |
| US-20150160552-A1 | Photoresist and Method | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2015-06-11 | — | — | US | disclosed |
| US-9052594-B2 | Positive photosensitive composition and method of forming pattern using the same | FUJIFILM CORPORATION (JP) | 2015-06-09 | — | — | US | disclosed |
| US-20150118621-A1 | METHOD OF FORMING PATTERN AND ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION FOR USE IN THE METHOD | FUJIFILM CORPORATION (JP) | 2015-04-30 | — | — | US | disclosed |
| US-20150111135-A1 | PATTERN FORMING METHOD AND ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION FOR USE IN THE METHOD | FUJIFILM CORPORATION (JP) | 2015-04-23 | — | — | US | disclosed |
| US-20140242505-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2014-08-28 | — | — | US | disclosed |
| US-20130015562-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2013-01-17 | — | — | US | disclosed |
| US-20130015562-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2013-01-17 | — | — | US | disclosed |
| US-20120094235-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2012-04-19 | — | — | US | disclosed |
| US-20120058431-A1 | POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME | FUJIFILM CORPORATION (JP) | 2012-03-08 | — | — | US | disclosed |
| US-20100203445-A1 | NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2010-08-12 | — | — | US | disclosed |
| US-20080206668-A1 | NEGATIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-08-28 | — | — | US | disclosed |
| US-20070172761-A1 | Positive photosensitive composition and method of forming pattern using the same | FUJIFILM CORPORATION (JP) | 2007-07-26 | — | — | US | disclosed |