SCHEMBL13163233

SCHEMBL13163233

O=C1OCCC1S(=O)(=O)Nc1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.43

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 1/20 0.43
▸ HDAC4 P56524 1/20 0.34
▸ SMN1; SMN2 Q16637 1/20 0.34
▸ KCNH3 Q9ULD8 1/20 0.33
▸ UCHL1 P09936 1/20 0.33
▸ USP30 Q70CQ3 1/20 0.33
▸ MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13163237 0.73 DDB1 (0.43) SMN1; SMN2
SCHEMBL13163234 0.73 KCNH3 (0.55) TSHRSMN1; SMN2KCNH3MAPK1
SCHEMBL19886461 0.70 TSHR (0.41) TSHRKCNH3MAPK1
SCHEMBL12996674 0.68 KDM4E (0.39) TSHRSMN1; SMN2MAPK1
SCHEMBL13131079 0.68 KDM4E (0.39) TSHRSMN1; SMN2MAPK1
SCHEMBL13163221 0.67 POLB (0.61) SMN1; SMN2MAPK1
SCHEMBL13163225 0.66 MAPT (0.34) TSHRSMN1; SMN2MAPK1
SCHEMBL10188365 0.66 HDAC8 (0.34) TSHRKCNH3MAPK1
SCHEMBL13163210 0.66 KCNH3 (0.39) KCNH3
SCHEMBL12996635 0.65 ELANE (0.40) TSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404427-B2 Photosensitive composition, and pattern-forming method and resist film using the photosensitive composition FUJIFILM CORPORATION (JP) 2013-03-26 — — US disclosed
US-20100239978-A1 PHOTOSENSITIVE COMPOSITION, AND PATTERN-FORMING METHOD AND RESIST FILM USING THE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2010-09-23 — — US disclosed
US-7749679-B2 Photosensitive composition, pattern-forming method using the photosensitive composition and compounds used in the photosensitive composition FUJIFILM CORPORATION (JP) 2010-07-06 — — US disclosed
US-20070148592-A1 Photosensitive composition, pattern-forming method using the photosensitive composition and compounds used in the photosensitive composition FUJIFILM CORPORATION (JP) 2007-06-28 — — US disclosed
Send feedback