SCHEMBL132093

SCHEMBL132093

CCC1(OC(=O)C(C)(C)CC)CCC(C(C)(C)C)CC1

nearest known ligand 0.36

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.36
ALDH1A1 P00352 1/20 0.36
LMNA P02545 1/20 0.36
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36
GAA P10253 1/20 0.36
CYP2C9 P11712 1/20 0.36
ALOX12 P18054 1/20 0.36
CYP2C19 P33261 1/20 0.36
HSD11B1 P28845 1/20 0.31
AQP3 Q92482 1/20 0.31
LIPA P38571 1/20 0.30
AQP1 P29972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16900294 0.89 KDM4E (0.37) KDM4EGAA
SCHEMBL17532395 0.88
SCHEMBL132094 0.86 HMGCR (0.32) KDM4ECYP2C9CYP2C19
SCHEMBL13607370 0.85
SCHEMBL20484024 0.83 ALDH1A1 (0.39) KDM4EALDH1A1LMNACYP1A2CYP3A4
SCHEMBL16900289 0.83 KDM4E (0.34) KDM4EALDH1A1LMNACYP1A2CYP3A4
SCHEMBL20484026 0.82 ALDH1A1 (0.39) KDM4EALDH1A1LMNACYP1A2CYP3A4
SCHEMBL17539211 0.82
SCHEMBL16900293 0.82 HMGCR (0.30)
SCHEMBL47494 0.82 HMGCR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9122152-B2 Patterning process and resist composition SHIN-ETSU CHEMICALS CO., LTD. (JP) 2015-09-01 US disclosed
US-9081290-B2 Patterning process and resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-07-14 US disclosed
US-9052594-B2 Positive photosensitive composition and method of forming pattern using the same FUJIFILM CORPORATION (JP) 2015-06-09 US disclosed
US-20120058431-A1 POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2012-03-08 US disclosed
US-20070172761-A1 Positive photosensitive composition and method of forming pattern using the same FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed