SCHEMBL1334341

SCHEMBL1334341

CCOc1c(N)ccc(-c2ccc(N)cc2)c1OCC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 4/20 0.47
TSHR P16473 1/20 0.47
MAPT P10636 5/20 0.46
ALDH1A1 P00352 4/20 0.46
MEN1 O00255 4/20 0.46
KMT2A Q03164 4/20 0.46
KDM4E B2RXH2 3/20 0.46
HSD17B10 Q99714 3/20 0.46
POLB P06746 2/20 0.46
HPGD P15428 2/20 0.46
MAPK1 P28482 2/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
PRKCZ Q05513 1/20 0.37
TP53 P04637 4/20 0.36
NPC1 O15118 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
RAB9A P51151 1/20 0.36
CNR1 P21554 1/20 0.35
CNR2 P34972 1/20 0.35
GAA P10253 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28284507 0.86 GAA (0.44) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL29885582 0.86 GAA (0.44) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL9117484 0.85 RAB9A (0.43) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL3787233 0.84 TDP1 (0.46) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL27571353 0.80 MAPT (0.52) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL11597444 0.76 ALDH1A1 (0.41) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL1119491 0.76 TDP1 (0.41) TDP1TSHRMAPTALDH1A1MEN1
Hydrochloric Acid SCHEMBL10604762 0.74 TDP1 (0.43) TDP1TSHRMAPTALDH1A1MEN1
Hydrochloric Acid SCHEMBL27791573 0.74 TDP1 (0.43) TDP1TSHRMAPTALDH1A1MEN1
SCHEMBL3788470 0.74 TDP1 (0.60) TDP1TSHRMAPTALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110324974-B Metal-clad laminate and circuit board 日铁化学材料株式会社 2024-07-02 CN disclosed
CN-118255987-A Polyamic acid, polyimide, resin film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2024-06-28 CN disclosed
CN-111746080-B Metal-clad laminate and circuit board 日铁化学材料株式会社 2024-01-16 CN disclosed
CN-117203264-A Polyimide precursor composition and polyimide 杰富意化学株式会社 2023-12-08 CN disclosed
WO-2023195206-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE JFEケミカル株式会社 2023-10-12 WO disclosed
CN-116787887-A Multilayer film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2023-09-22 CN disclosed
CN-116194435-A Fluorine-containing diamine or salt thereof, method for producing fluorine-containing diamine or salt thereof, polyamide, method for producing polyamide, polyamide solution, polyamide cyclized body, method for producing polyamide cyclized body, insulating material for high-frequency electronic component, method for producing insulating material for high-frequency electronic component, high-frequency machine, and insulating material for producing high-frequency electronic component 中央硝子株式会社 2023-05-30 CN disclosed
CN-115536844-A Polyamic acid, polyimide film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2022-12-30 CN disclosed
CN-115134990-A Circuit board 日铁化学材料株式会社 2022-09-30 CN disclosed
CN-109575596-B Metal-clad laminate 日铁化学材料株式会社 2022-08-23 CN disclosed
EP-0596150-B1 Solutions of polyimide precursors BASF LACKE & FARBEN (DE) 1997-02-05 EP disclosed
EP-0596149-B1 Solutions of polyimide precursors BASF LACKE & FARBEN (DE) 1996-10-16 EP disclosed
US-5489644-A COMPRISING AROMATIC DIAMINES AND TETRAESTER OF AROMATIC TETRACARBOXYLIC ACID; PROTECTIVE COATING FOR METALS, SILICON WAFERS, GLASS BASF LACKE + FARBEN (DE) 1996-02-06 US disclosed
EP-0659800-A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition CENTRAL GLASS COMPANY, LIMITED (JP) 1995-06-28 EP disclosed
EP-0621299-A1 Solutions of polyimide-forming substances and their use as coating material BASF Lacke + Farben AG (DE) 1994-10-26 EP disclosed
US-5332799-A Aromatic diamines, diesters of aromatic tetracarboxylic acids, circuit coatings BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) 1994-07-26 US disclosed
EP-0596150-A1 Solutions of polyimide precursors BASF Lacke + Farben Aktiengesellschaft (DE) 1994-05-11 EP disclosed
EP-0596149-A1 Solutions of polyimide precursors BASF Lacke + Farben Aktiengesellschaft (DE) 1994-05-11 EP disclosed
US-5264545-A Aromatic or partly aromatic diamine with tetracarboxylic acid BASF LACKE+FARBEN AKTIENGESELLSCHAFT (DE) 1993-11-23 US disclosed
CN-1078569-A Insulated electric conductor SUMITOMO ELECTRIC INDUSTRIES (JP) 1993-11-17 CN disclosed