SCHEMBL134119

SCHEMBL134119

CC1(N)CCC(CC2CCC(C)(N)CC2)CC1

nearest known ligand 0.46

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
KDM1A O60341 1/20 0.31
MAOB P27338 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25568569 0.81 ALDH1A1 (0.44) ALDH1A1TDP1KDM1AMAOB
SCHEMBL25568576 0.81 ALDH1A1 (0.44) ALDH1A1TDP1KDM1AMAOB
SCHEMBL1933555 0.81 ALDH1A1 (0.44) ALDH1A1TDP1KDM1AMAOB
SCHEMBL19525730 0.81 ALDH1A1 (0.44) ALDH1A1TDP1KDM1AMAOB
SCHEMBL15271364 0.79 ALDH1A1 (0.44) ALDH1A1TDP1
SCHEMBL27633638 0.77 ALDH1A1 (0.46) ALDH1A1TDP1
SCHEMBL26435620 0.77 MAPT (0.35)
SCHEMBL539166 0.77
SCHEMBL134665 0.74
SCHEMBL24731320 0.74 ALDH1A1 (0.39) ALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0507735-B1 Adducts from epoxy resins and amines CIBA GEIGY AG (CH) 1997-08-20 EP claimed
EP-0441423-B1 Polyamide resin composition DSM NV (NL) 1994-08-03 EP claimed
US-5206310-A Blend of nylon 4.6, aliphatic polyamide and noncrystalline polyamide having glass transition temperature of at least 100 degrees YASUE KENJI (JP) 1993-04-27 US claimed
EP-0441423-A1 Polyamide resin composition DSM N.V. (NL) 1991-08-14 EP claimed
EP-4700081-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-02-25 EP disclosed
EP-4685188-A1 THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-01-28 EP disclosed
US-12497296-B2 Carbon nanotube having low density and composite material including the same LG CHEM, LTD. (KR) 2025-12-16 US disclosed
US-20250011583-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME LG CHEM, LTD. (KR) 2025-01-09 US disclosed
EP-3421423-B1 CARBON COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME LG CHEMICAL LTD (KR) 2024-10-02 EP disclosed
CN-115667138-B Carbon nanotubes with low density and composite materials containing the same 株式会社LG化学 2024-01-26 CN disclosed
EP-4269495-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE MANUFACTURED THEREFROM LG Chem, Ltd. (KR) 2023-11-01 EP disclosed
US-11773233-B2 Carbon composite material and method for producing same LG CHEM, LTD. (KR) 2023-10-03 US disclosed
WO-2010146143-A1 COMPOSITION OF A BLEND OF POLYAMIDE AND POLYESTER RESINS RHODIA OPERATIONS (FR) 2010-12-23 WO disclosed
EP-2164903-A1 THERMOPLASTIC POLYAMIDE RESIN COMPOSITION HAVING IMPROVED PAINT ADHESION Rhodia Polyamide Co., Ltd (KR) 2010-03-24 EP disclosed
US-20090166593-A1 Antistatic Thermoplastic Resin Composition CHEIL INDUSTRIES INC. (KR) 2009-07-02 US disclosed
WO-2009005260-A1 THERMOPLASTIC POLYAMIDE RESIN COMPOSITION HAVING IMPROVED PAINT ADHESION RHODIA POLYAMIDE CO., LTD (KR) 2009-01-08 WO disclosed
EP-0667367-A2 Partially aromatic copolyamid mouldings with higher crystallinity BASF Aktiengesellschaft (DE) 1995-08-16 EP disclosed
EP-0441423-B1 Polyamide resin composition DSM NV (NL) 1994-08-03 EP disclosed
US-5206310-A Blend of nylon 4.6, aliphatic polyamide and noncrystalline polyamide having glass transition temperature of at least 100 degrees YASUE KENJI (JP) 1993-04-27 US disclosed
EP-0441423-A1 Polyamide resin composition DSM N.V. (NL) 1991-08-14 EP disclosed