SCHEMBL1345169

SCHEMBL1345169

CC([Si](C)(C)N(C)C)[Si](C)(C)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31722329 0.86
SCHEMBL2273048 0.77
SCHEMBL31722470 0.67
SCHEMBL31722488 0.67
SCHEMBL2101108 0.65
SCHEMBL4084711 0.64
SCHEMBL31722388 0.62
SCHEMBL31686188 0.59
SCHEMBL430721 0.59
SCHEMBL377532 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8062820-B2 Toner composition and method of preparing same CABOT CORPORATION (US) 2011-11-22 US claimed
WO-2007133669-A2 TONER COMPOSITION AND METHOD OF PREPARING SAME CABOT CORPORATION (US) 2007-11-22 WO claimed
US-20070264502-A1 Toner composition and method of preparing same CABOT CORPORATION (US) 2007-11-15 US claimed
CN-122029986-A Processing method, semiconductor device manufacturing method, processing device, and program 株式会社国际电气 2026-05-12 CN disclosed
EP-4080548-B1 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND PROGRAM KOKUSAI ELECTRIC CORP (JP) 2026-04-29 EP disclosed
EP-4724526-A1 CONDENSATION CURE SILICONE ADHESIVE Momentive Performance Materials Inc. (US) 2026-04-15 EP disclosed
US-12581878-B2 Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium Kokusai Electric Corporation (JP) 2026-03-17 US disclosed
US-20260060019-A1 PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2026-02-26 US disclosed
US-20250391678-A1 METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2025-12-25 US disclosed
US-20250379060-A1 ETCHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2025-12-11 US disclosed
US-20250336670-A1 PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2025-10-30 US disclosed
WO-2008042986-A2 HYDROPHOBIC AND OLEOPHOBIC COATING AND METHOD FOR PREPARING THE SAME SONIC INNOVATIONS, INC. (US) 2008-04-10 WO disclosed
WO-2007133669-A2 TONER COMPOSITION AND METHOD OF PREPARING SAME CABOT CORPORATION (US) 2007-11-22 WO disclosed
US-20070264502-A1 Toner composition and method of preparing same CABOT CORPORATION (US) 2007-11-15 US disclosed
EP-1807347-A2 METHOD OF PREPARING HYDROPHOBIC SILICA DIRECTLY FROM AN AQUEOUS COLLOIDAL SILICA DISPERSION CABOT CORPORATION (US) 2007-07-18 EP disclosed
US-20060171872-A1 silylamine treating agent; reacting the surface silanol groups to effectively replace the hydrophilic silanol groups with hydrophobic chemical group; toners CABOT CORPORATION (US) 2006-08-03 US disclosed
WO-2006045012-A2 METHOD OF PREPARING HYDROPHOBIC SILICA DIRECTLY FROM AN AQUEOUS COLLOIDAL SILICA DISPERSION CABOT CORPORATION (US) 2006-04-27 WO disclosed
EP-1051461-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR, William C. (US) 2000-11-15 EP disclosed
WO-1999066009-A2 FUEL COMPOSITIONS EMPLOYING CATALYST COMBUSTION STRUCTURE ORR WILLIAM C (US) 1999-12-23 WO disclosed
WO-1997041140-A1 MODIFIED OLIGONUCLEOTIDES NOVARTIS AG (CH) 1997-11-06 WO disclosed