Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP19A1 | P11511 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 3/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.35 |
| ▸ | CPA1 | P15085 | 6/20 | 0.35 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | GSR | P00390 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | PTPRC | P08575 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8331181 | 0.82 | LMNA (0.40) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL9098447 | 0.81 | CYP19A1 (0.37) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL10788518 | 0.81 | CYP19A1 (0.37) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL8331186 | 0.80 | CYP19A1 (0.42) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL9389411 | 0.79 | CYP19A1 (0.36) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL11131350 | 0.79 | CYP19A1 (0.36) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL28052003 | 0.77 | CYP1A2 (0.41) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL26929273 | 0.77 | CYP2C19 (0.44) | CYP19A1ALDH1A1LMNACYP2C19HIF1A | |
| SCHEMBL11854163 | 0.77 | ALDH1A1 (0.50) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 | |
| SCHEMBL11830161 | 0.77 | CYP2C19 (0.38) | CYP19A1ALDH1A1LMNACYP2C19CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109096117-B | Preparation method of 1-phenyl-2-nitroethanol and derivatives thereof | 南京信息工程大学 | 2020-12-25 | — | — | CN | disclosed |
| CN-109096117-A | The preparation method of 1- phenyl -2- nitroethyl alcohol and its derivative | 南京信息工程大学 | 2018-12-28 | — | — | CN | disclosed |
| CN-101371197-B | Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board | KANEKA CORP | 2012-12-26 | — | — | CN | disclosed |
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| CN-101371197-A | Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board | KANEGAFUCHI CHEMICAL IND (JP) | 2009-02-18 | — | — | CN | disclosed |
| CN-1324402-C | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEGAFUCHI CHEMICAL IND (JP) | 2007-07-04 | — | — | CN | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| CN-1599884-A | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEGAFUCHI CHEMICAL IND (JP) | 2005-03-23 | — | — | CN | disclosed |
| US-20040265731-A1 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2004-12-30 | — | — | US | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |