Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.55 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.43 |
| ▸ | HTT | P42858 | 1/20 | 0.43 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.41 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | GAA | P10253 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.40 |
| ▸ | DNA2 | P51530 | 1/20 | 0.40 |
| ▸ | CASP6 | P55212 | 1/20 | 0.40 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.40 |
| ▸ | AKR1C3 | P42330 | 2/20 | 0.39 |
| ▸ | AKR1C2 | P52895 | 2/20 | 0.39 |
| ▸ | AKR1B10 | O60218 | 1/20 | 0.39 |
| ▸ | AKR1B1 | P15121 | 1/20 | 0.39 |
| ▸ | AKR1C4 | P17516 | 1/20 | 0.39 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2000365 | 0.83 | ALDH1A1 (0.47) | TSHRTDP1ALDH1A1HTTKDM4E | |
| SCHEMBL521662 | 0.80 | TSHR (0.68) | TSHRTDP1L3MBTL1ALDH1A1KDM4E | |
| SCHEMBL1348294 | 0.78 | TSHR (0.45) | TSHRTDP1L3MBTL1ALDH1A1HTT | |
| SCHEMBL1348296 | 0.78 | TSHR (0.45) | TSHRTDP1L3MBTL1ALDH1A1HTT | |
| SCHEMBL27664107 | 0.78 | KDM4E (0.59) | TSHRTDP1L3MBTL1ALDH1A1KDM4E | |
| SCHEMBL346597 | 0.77 | MAPK1 (0.50) | TSHRTDP1ALDH1A1HTTKDM4E | |
| SCHEMBL15623 | 0.77 | TSHR (0.58) | TSHRTDP1L3MBTL1ALDH1A1KDM4E | |
| SCHEMBL14973533 | 0.77 | TSHR (0.58) | TSHRTDP1L3MBTL1ALDH1A1KDM4E | |
| SCHEMBL1606328 | 0.77 | ALDH1A1 (0.58) | TSHRTDP1L3MBTL1ALDH1A1HTT | |
| SCHEMBL14329478 | 0.77 | TSHR (0.58) | TSHRTDP1L3MBTL1ALDH1A1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8063245-B2 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20100218984-A1 | PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD MAKING USE OF THE SAME, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | KANEKA CORPORATION (JP) | 2010-09-02 | — | — | US | disclosed |
| US-7396898-B2 | Diamine, acid dianhydride, and reactive group containing polyimide composition prepared therefrom and process of preparing them | KANEKA CORPORATION (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7141614-B2 | Photosensitive resin composition and photosensitive films and laminates made by using the same | KANEKA CORPORATION (JP) | 2006-11-28 | — | — | US | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20040158030-A1 | Diamine, acid dianhydride, polymide composition having reactive group obtained therefrom, and processes for producing these | KANEKA CORPORATION (JP) | 2004-08-12 | — | — | US | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |