Diphenamide

Diphenamide

SCHEMBL135233

CN(C)C(=O)C(c1ccccc1)c1ccccc1.N#CC#N

nearest known ligand 0.49

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.49
ATM Q13315 1/20 0.49
ALDH1A1 P00352 2/20 0.49
TDP1 Q9NUW8 3/20 0.47
OPRM1 P35372 1/20 0.47
OPRL1 P41146 1/20 0.47
TACR1 P25103 3/20 0.46
CTSD P07339 1/20 0.46
MEN1 O00255 4/20 0.45
KMT2A Q03164 4/20 0.45
CRHBP P24387 1/20 0.45
CRHR2 Q13324 1/20 0.45
L3MBTL1 Q9Y468 1/20 0.44
HDAC3 O15379 1/20 0.42
HDAC4 P56524 1/20 0.42
HDAC1 Q13547 1/20 0.42
HDAC7 Q8WUI4 1/20 0.42
HDAC2 Q92769 1/20 0.42
HDAC10 Q969S8 1/20 0.42
HDAC11 Q96DB2 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Diphenamide SCHEMBL4653009 0.96 KDM4E (0.46) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL4196621 0.94 KDM4E (0.47) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL9333428 0.92 ALDH1A1 (0.51) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL39339 0.92 ALDH1A1 (0.55) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL6910614 0.92 ALDH1A1 (0.55) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL9202269 0.92 ALDH1A1 (0.55) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL2422747 0.90 KDM4E (0.50) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL23534079 0.90 ALDH1A1 (0.53) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL2516775 0.90 ALDH1A1 (0.53) KDM4EATMALDH1A1TDP1OPRM1
Diphenamide SCHEMBL2051916 0.90 ALDH1A1 (0.53) KDM4EATMALDH1A1TDP1OPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 695 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920027-B2 Epoxy resin composition, molding material, and fiber-reinforced composite material MITSUBISHI CHEMICAL CORPORATION (JP) 2021-02-16 US claimed
EP-3425005-B1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI CHEM CORP (JP) 2020-08-12 EP claimed
US-20200140633-A1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2020-05-07 US claimed
EP-3425005-A1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL Mitsubishi Chemical Corporation (JP) 2019-01-09 EP claimed
US-9550911-B2 Fluorinated alkyl ether epoxy resin compositions and applications thereof The United States of America as represented by the Administrtor of the National Aeronautics and Space Administration (US) 2017-01-24 US claimed
US-20150344748-A1 Fluorinated Alkyl Ether Epoxy Resin Compositions and Applications Thereof UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION 2015-12-03 US claimed
CN-102558233-B From the derivative phosphorus series bisphenols of benzoxazine, its epoxy resin semicure thing, its epoxy resin cured product and manufacture method thereof XIAO JIEFU (CN) 2015-08-26 CN claimed
US-8480845-B2 Thermosetting solvent-free single-component compositions and their use DELO INDUSTRIEKLEBSTOFFE GMBH & CO. KG (DE) 2013-07-09 US claimed
CN-102719058-A One liquid type cyanate-epoxy composite resin composition ADEKA CORP 2012-10-10 CN claimed
CN-101679608-B One-pack type cyanate-epoxy composite resin composition ADEKA CORP 2012-07-18 CN claimed
CN-1350030-A flame-retardant epoxy resin composition and application thereof CHANGCHUN ARTIFICIAL RESIN PLA (CN) 2002-05-22 CN claimed
US-6306940-B1 Colorant concentrates for dyeing polyoxymethylene moulding materials TICONA GMBH (DE) 2001-10-23 US claimed
CN-1297960-A Epoxy resin composition and semi-solidified sheet and multilayer printed circuit board produced therewith MATSUSHITA ELECTRIC WORKS LTD (JP) 2001-06-06 CN claimed
US-20010000518-A1 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof SEKIMOTO AKIO (JP) 2001-04-26 US claimed
CN-1239492-A Dithiocarbonate compositions KYOWA YUKA KK (JP) 1999-12-22 CN claimed
US-6000189-A BUILDING SURFACES WOLMAN GMBH (DE) 1999-12-14 US claimed
EP-0635380-A1 Coloring composition for image recording DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) 1995-01-25 EP claimed
US-5248559-A Laminates with lubricants HONDA GIKEN KOGYO KABUSHIKI KAISHA (JP) 1993-09-28 US claimed
CN-1053802-A PREIMPREGNATED PRODUCTS WITH EPOXYLITE NIPPON STEEL CHEMICAL CO (JP) 1991-08-14 CN claimed
EP-0307987-A2 Flexible polyurethane foam having a high fire resistance RECTICEL (BE) 1989-03-22 EP claimed