Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.50 |
| ▸ | ATM | Q13315 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.49 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.49 |
| ▸ | OPRL1 | P41146 | 1/20 | 0.49 |
| ▸ | TACR1 | P25103 | 3/20 | 0.47 |
| ▸ | MEN1 | O00255 | 4/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.46 |
| ▸ | CRHBP | P24387 | 1/20 | 0.46 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.44 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.44 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.44 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.44 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.44 |
| ▸ | HDAC10 | Q969S8 | 1/20 | 0.44 |
| ▸ | HDAC11 | Q96DB2 | 1/20 | 0.44 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Diphenamide SCHEMBL12501720 | 0.94 | ALDH1A1 (0.56) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL9202269 | 0.94 | ALDH1A1 (0.55) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL6910614 | 0.94 | ALDH1A1 (0.55) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL39339 | 0.94 | ALDH1A1 (0.55) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL23534079 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL10338756 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL2051916 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL22345014 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL11211674 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 | |
| Diphenamide SCHEMBL12477138 | 0.92 | ALDH1A1 (0.53) | KDM4EATMALDH1A1TDP1OPRM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-62128165-A | — | — | None | — | — | JP | disclosed |
| JP-5129347-A | — | — | None | — | — | JP | disclosed |
| US-10113111-B2 | Treated fillers and uses thereof | DOW SILICONES CORPORATION (US) | 2018-10-30 | — | — | US | disclosed |
| EP-2607413-B1 | Plastic Substrate for Automotive Glazing and Its Repairing Method | SHINETSU CHEMICAL CO (JP) | 2017-06-21 | — | — | EP | disclosed |
| WO-2016126326-A1 | TREATED FILLERS AND USES THEREOF | DOW CORNING CORPORATION (US) | 2016-08-11 | — | — | WO | disclosed |
| US-20160230084-A1 | Treated Fillers And Uses Thereof | DOW SILICONES CORPORATION | 2016-08-11 | — | — | US | disclosed |
| US-20130164539-A1 | PLASTIC SUBSTRATE FOR AUTOMOTIVE GLAZING AND ITS REPAIRING METHOD | KABUSHIKI KAISHA TOYOTA JIDOSHOKKI (JP) | 2013-06-27 | — | — | US | disclosed |
| EP-2607413-A1 | Plastic Substrate for Automotive Glazing and Its Repairing Method | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-06-26 | — | — | EP | disclosed |
| US-8198544-B2 | Printed wiring board and manufacturing method thereof | IBIDEN CO., LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| EP-1835790-B1 | PRINTED WIRING BOARD | IBIDEN CO LTD (JP) | 2011-11-02 | — | — | EP | disclosed |
| US-8013057-B2 | White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-09-06 | — | — | US | disclosed |
| US-20100252308-A1 | PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF | IBIDEN CO., LTD. (JP) | 2010-10-07 | — | — | US | disclosed |
| US-7804031-B2 | Printed wiring board and manufacturing method thereof | IBIDEN CO., LTD. (JP) | 2010-09-28 | — | — | US | disclosed |
| US-20090239997-A1 | WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTICAL SEMICONDUCTOR CASE AND OPTICAL SEMICONDUCTOR CASE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-09-24 | — | — | US | disclosed |
| US-20070273047-A1 | PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF | IBIDEN CO., LTD (JP) | 2007-11-29 | — | — | US | disclosed |
| EP-1835790-A1 | PRINTED WIRING BOARD | IBIDEN CO., LTD. (JP) | 2007-09-19 | — | — | EP | disclosed |
| JP-H05129347-A | BONDING AGENT FOR SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | HITACHI CHEM CO LTD | 1993-05-25 | — | — | JP | disclosed |
| JP-S62128165-A | SUNSTRATE FOR MODULE | HITACHI LTD | 1987-06-10 | — | — | JP | disclosed |