SCHEMBL1354705

SCHEMBL1354705

CC(C)(C)c1cc(OCC2CO2)ccc1OCC1CO1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.56
TSHR P16473 4/20 0.56
TP53 P04637 3/20 0.56
MAPT P10636 3/20 0.56
HPGD P15428 2/20 0.56
HIF1A Q16665 2/20 0.56
MEN1 O00255 2/20 0.56
KMT2A Q03164 2/20 0.56
CYP1A2 P05177 1/20 0.56
PPARG P37231 1/20 0.56
CYP3A4 P08684 1/20 0.54
SMN1; SMN2 Q16637 1/20 0.54
GLA P06280 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
PKM P14618 2/20 0.45
LMNA P02545 2/20 0.45
GAA P10253 2/20 0.45
VDR P11473 1/20 0.41
FGFR1 P11362 1/20 0.40
SRC P12931 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8432636 0.91 ALDH1A1 (0.50) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL2719651 0.90 ALDH1A1 (0.56) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL7705103 0.87 MEN1 (0.52) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL3148512 0.85 ALDH1A1 (0.53) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL9091679 0.85 ALDH1A1 (0.51) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL2828165 0.84 ALDH1A1 (0.50) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL2717429 0.84 ALDH1A1 (0.50) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL2718023 0.84 ALDH1A1 (0.50) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL1356636 0.84 ALDH1A1 (0.51) ALDH1A1TSHRTP53MAPTHPGD
SCHEMBL15346365 0.84 ALDH1A1 (0.55) ALDH1A1TSHRTP53MAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024143148-A1 METHOD FOR PRODUCING FILM-LIKE BONDING MATERIAL 株式会社レゾナック 2024-07-04 WO disclosed
WO-2024135707-A1 METHOD FOR MANUFACTURING BONDED BODY 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024135807-A1 SOLID THERMALLY-CONDUCTIVE MATERIAL 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024135640-A1 METHOD FOR PRODUCING JOINED OBJECT 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024135808-A1 JOINING METHOD 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024134904-A1 THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024135638-A1 METHOD FOR PRODUCING JOINED OBJECT 株式会社レゾナック 2024-06-27 WO disclosed
CN-117903565-A Halogen-free flame-retardant epoxy resin composition, cured product, prepreg and laminated board 中国石油化工股份有限公司 2024-04-19 CN disclosed
CN-117903417-A In-situ polymerization type thermoplastic epoxy resin composition, preparation method and composite material gas cylinder 中国石油化工股份有限公司 2024-04-19 CN disclosed
CN-117903566-A Rapid-curing halogen-free flame-retardant epoxy resin composition, and preparation method and application thereof 中国石油化工股份有限公司 2024-04-19 CN disclosed
US-20150159040-A1 LOW-VISCOSITY PHENOLIC DIGLYCIDYL ETHERS FOR EPOXY COATING APPLICATIONS BLUE CUBE IP LLC 2015-06-11 US disclosed
US-20150159040-A1 LOW-VISCOSITY PHENOLIC DIGLYCIDYL ETHERS FOR EPOXY COATING APPLICATIONS BLUE CUBE IP LLC 2015-06-11 US disclosed
EP-2859030-A2 LOW-VISCOSITY PHENOLIC DIGLYCIDYL ETHERS FOR EPOXY COATING APPLICATIONS Dow Global Technologies LLC (US) 2015-04-15 EP disclosed
US-20140194590-A1 PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION NAGASE CHEMTEX CORPORATION (JP) 2014-07-10 US disclosed
WO-2013188255-A2 LOW-VISCOSITY PHENOLIC DIGLYCIDYL ETHERS FOR EPOXY COATING APPLICATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-12-19 WO disclosed
US-20110288259-A1 PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION NAGASE CHEMTEX CORPORATION (JP) 2011-11-24 US disclosed
EP-2386587-A1 PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION Nagase ChemteX Corporation (JP) 2011-11-16 EP disclosed
US-20110253243-A1 Flexible duct apparatus and method for use in aircraft environmental control systems TOMERLIN REG 2011-10-20 US disclosed
US-20090215929-A1 Method for Producing Fiber-Reinforced Thermally Meltable Epoxy Resin NAGASE CHEMTEX CORPORATION (JP) 2009-08-27 US disclosed
EP-1882714-A1 METHOD FOR PRODUCING FIBER-REINFORCED THERMALLY MOLTEN EPOXY RESIN Nagase Chemtex Corporation (JP) 2008-01-30 EP disclosed