Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.53 |
| ▸ | POLB | P06746 | 1/20 | 0.53 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | MTNR1A | P48039 | 1/20 | 0.45 |
| ▸ | MTNR1B | P49286 | 1/20 | 0.45 |
| ▸ | NPC1 | O15118 | 2/20 | 0.44 |
| ▸ | RAB9A | P51151 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.42 |
| ▸ | MEN1 | O00255 | 3/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.41 |
| ▸ | FAAH | O00519 | 1/20 | 0.41 |
| ▸ | MGLL | Q99685 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15966114 | 0.92 | ALDH1A1 (0.51) | ALDH1A1POLBCYP2D6L3MBTL1KDM4E | |
| SCHEMBL1357852 | 0.88 | MEN1 (0.46) | ALDH1A1POLBCYP2D6L3MBTL1KDM4E | |
| SCHEMBL10360681 | 0.86 | ALDH1A1 (0.45) | ALDH1A1POLBKMT2AMEN1LMNA | |
| SCHEMBL14962142 | 0.85 | ALDH1A1 (0.44) | ALDH1A1POLBCYP2D6KMT2AMEN1 | |
| SCHEMBL13298530 | 0.84 | POLB (0.46) | ALDH1A1POLBKDM4EHTTKMT2A | |
| SCHEMBL15964855 | 0.83 | ALDH1A1 (0.43) | ALDH1A1POLBCYP2D6KMT2AMEN1 | |
| SCHEMBL17763408 | 0.83 | ALDH1A1 (0.45) | ALDH1A1POLBL3MBTL1RAB9ATDP1 | |
| SCHEMBL1358578 | 0.81 | ALDH1A1 (0.51) | ALDH1A1POLBSMN1; SMN2HTTRAB9A | |
| SCHEMBL1357965 | 0.81 | ALDH1A1 (0.46) | ALDH1A1POLBKDM4EHTTMTNR1A | |
| SCHEMBL31692796 | 0.81 | POLB (0.43) | ALDH1A1POLBCYP2D6L3MBTL1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 91 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10409160-B2 | Photoimageable polyolefin compositions containing photobase generators | PROMERUS, LLC (US) | 2019-09-10 | — | — | US | claimed |
| US-20180203349-A1 | PHOTOIMAGEABLE POLYOLEFIN COMPOSITIONS CONTAINING PHOTOBASE GENERATORS | PROMERUS, LLC (US) | 2018-07-19 | — | — | US | claimed |
| US-9952507-B2 | Photoimageable polyolefin compositions containing photobase generators | PROMERUS, LLC (US) | 2018-04-24 | — | — | US | claimed |
| WO-2016133795-A1 | PHOTOIMAGEABLE POLYOLEFIN COMPOSITIONS CONTAINING PHOTOBASE GENERATORS | PROMERUS, LLC (US) | 2016-08-25 | — | — | WO | claimed |
| US-20160238932-A1 | PHOTOIMAGEABLE POLYOLEFIN COMPOSITIONS CONTAINING PHOTOBASE GENERATORS | SUMITOMO BAKELITE CO., LTD. (JP) | 2016-08-18 | — | — | US | claimed |
| EP-4748893-A1 | PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| WO-2025126839-A1 | RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2025-06-19 | — | — | WO | disclosed |
| WO-2025023159-A1 | PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION | ナミックス株式会社 | 2025-01-30 | — | — | WO | disclosed |
| CN-115561966-B | Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | disclosed |
| CN-115561966-A | Chemical amplification type negative photosensitive polyimide coating adhesive and application | 明士(北京)新材料开发有限公司 | 2023-01-03 | — | — | CN | disclosed |
| EP-4063953-A1 | PATTERN FORMING METHOD, PHOTOCURABLE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | FUJIFILM Corporation (JP) | 2022-09-28 | — | — | EP | disclosed |
| US-10634998-B2 | Photoimageable polyolefin compositions containing photobase generators | PROMERUS, LLC (US) | 2020-04-28 | — | — | US | disclosed |
| US-20110086311-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2011-04-14 | — | — | US | disclosed |
| WO-2011040441-A1 | HEAT-CONDUCTIVE SEALING MEMBER AND ELECTROLUMINESCENT DEVICE | 大日本印刷株式会社 (JP) | 2011-04-07 | — | — | WO | disclosed |
| US-20100137490-A1 | RESIN COMPOSITION, CURED PRODUCT AND OPTICAL PARTS | TOKYO INSTITUTE OF TECHNOLOGY (JP) | 2010-06-03 | — | — | US | disclosed |
| US-7714096-B2 | Resin composition, cured product and optical parts | TOKYO INSTITUTE OF TECHNOLOGY (JP) | 2010-05-11 | — | — | US | disclosed |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| WO-2009123122-A1 | BASE-GENERATING AGENT, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN-FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION, AND ARTICLE | 大日本印刷株式会社 (JP) | 2009-10-08 | — | — | WO | disclosed |
| US-20080255284-A1 | RESIN COMPOSITION, CURED PRODUCT AND OPTICAL PARTS | TOKYO INSTITUTE OF TECHNOLOGY (JP) | 2008-10-16 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20110086311-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | RER1, SUN2, LCP1 | ALDH1A1 2591/4885POLB 194/4885CYP2D6 2999/4885 |
| US-20090263745-A1 | POLYIMIDE PRECURSOR, RESIN COMPOSITION COMPRISING THE POLYIMIDE PRECURSOR, PATTERN FORMING METHOD USING THE RESIN COMPOSITION, AND ARTICLES PRODUCED BY USING THE RESIN COMPOSITION | TERB1, PUF60, CD79B | ALDH1A1 2911/4885POLB 647/4885CYP2D6 4089/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.