SCHEMBL1357530

SCHEMBL1357530

C=C(C)C(=O)OCCOC1CC2CC1C1CCCC21

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.40
MAPT P10636 3/20 0.39
ALDH1A1 P00352 3/20 0.39
CA1 P00915 3/20 0.39
CA2 P00918 3/20 0.39
CA12 O43570 2/20 0.39
GMNN O75496 2/20 0.39
LMNA P02545 2/20 0.39
BLM P54132 2/20 0.39
CA9 Q16790 2/20 0.39
TDP1 Q9NUW8 2/20 0.39
SGMS1 Q86VZ5 1/20 0.39
SGMS2 Q8NHU3 1/20 0.39
TSHR P16473 4/20 0.38
KDM4E B2RXH2 1/20 0.38
MEN1 O00255 1/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
ALOX15 P16050 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22200980 0.88 MAPT (0.40) THRBMAPTALDH1A1CA1CA2
SCHEMBL75207 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL14413809 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL21653902 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL17707977 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL24084357 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL22841009 0.80 ALDH1A1 (0.53) MAPTALDH1A1CA1CA2CA12
SCHEMBL22610213 0.80 TSHR (0.41) THRBMAPTALDH1A1CA1CA2
SCHEMBL1357269 0.80 TSHR (0.41) THRBMAPTALDH1A1CA1CA2
SCHEMBL12511467 0.78 THRB (0.43) THRBALDH1A1CA1CA2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023204281-A1 RESIN COMPOSITION FOR THERMOSETTING PHOTO-ALIGNMENT FILMS 日産化学株式会社 2023-10-26 WO disclosed
WO-2023157934-A1 RESIN COMPOSITION FOR THERMOSETTING PHOTO-ALIGNMENT FILMS 日産化学株式会社 2023-08-24 WO disclosed
US-10392699-B2 Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device JSR CORPORATION (JP) 2019-08-27 US disclosed
US-20170306481-A1 METHOD FOR MANUFACTURING STRUCTURE HAVING RECESSED PATTERN, RESIN COMPOSITION, METHOD FOR FORMING ELECTROCONDUCTIVE FILM, ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2017-10-26 US disclosed
US-9746775-B2 Method for manufacturing substrate having concave pattern, composition, method for forming conductive film, electronic circuit and electronic device JSR CORPORATION (JP) 2017-08-29 US disclosed
US-9488911-B2 Photosensitive composition, photocurable composition, chemical amplification resist composition, resist film, pattern forming method, method of manufacturing electronic device and electronic device FUJIFILM CORPORATION (JP) 2016-11-08 US disclosed
US-20160299376-A1 LIQUID CRYSTAL DISPLAY DEVICE, RADIATION-SENSITIVE RESIN COMPOSITION, INTERLAYER INSULATING FILM, METHOD FOR PRODUCING INTERLAYER INSULATING FILM, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE JSR CORPORATION (JP) 2016-10-13 US disclosed
EP-2993519-A1 METHOD FOR MANUFACTURING BASE MATERIAL HAVING RECESSED PATTERN, COMPOSITION, METHOD FOR FORMING ELECTRICALLY CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR Corporation (JP) 2016-03-09 EP disclosed
US-20160062242-A1 METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-03 US disclosed
US-20160054616-A1 ARRAY SUBSTRATE, LIQUID CRYSTAL DISPLAY ELEMENT, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2016-02-25 US disclosed
US-8211508-B2 radiation curing ink cures with high sensitivity to form a high quality, durable image resistant to cracking, peeling and has excellent impact resistance, flexibility, and adhesion; cyclic monofunctional acrylic or N-vinyl monomers FUJIFILM CORPORATION (JP) 2012-07-03 US disclosed
US-20110281040-A1 LIQUID CRYSTAL DISPLAY ELEMENT, POSITIVE TYPE RADIATION SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM FOR LIQUID CRYSTAL DISPLAY ELEMENT, AND FORMATION METHOD THEREOF JSR CORPORATION (JP) 2011-11-17 US disclosed
EP-2371910-A1 Ink composition, inkjet recording method and process for producing molded printed material Fujifilm Corporation (JP) 2011-10-05 EP disclosed
EP-2233538-A1 Photocurable composition Fujifilm Corporation (JP) 2010-09-29 EP disclosed
US-20100209847-A1 COPOLYMER, RESIN COMPOSITION, SPACER FOR DISPLAY PANEL, PLANARIZATION FILM, THERMOSETTING PROTECTIVE FILM, MICROLENS, AND PROCESS FOR PRODUCING COPOLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-19 US disclosed
EP-2105478-A1 Inkjet recording method and inkjet recording system FUJIFILM Corporation (JP) 2009-09-30 EP disclosed
US-20090087627-A1 WHITE INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
EP-2042568-A1 Ink composition, inkjet recording method, and printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-2042572-A1 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed