SCHEMBL13601054

SCHEMBL13601054

O=C(Nc1ccccc1)c1cccc(Oc2cccc(C(=O)Nc3ccccc3)c2)c1

nearest known ligand 0.77

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.77
RAB9A P51151 2/20 0.77
SMN1; SMN2 Q16637 1/20 0.77
FFAR1 O14842 1/20 0.72
PGR P06401 2/20 0.70
MEN1 O00255 4/20 0.68
KMT2A Q03164 4/20 0.68
HDAC8 Q9BY41 2/20 0.68
KCNK3 O14649 2/20 0.68
KCNK9 Q9NPC2 2/20 0.68
FABP1 P07148 1/20 0.66
NR1H4 Q96RI1 1/20 0.66
HDAC1 Q13547 1/20 0.65
HDAC2 Q92769 1/20 0.65
HDAC6 Q9UBN7 1/20 0.65
POLB P06746 1/20 0.62
NLRP3 Q96P20 1/20 0.62
CASP3 P42574 1/20 0.61
SENP8 Q96LD8 1/20 0.61
SENP7 Q9BQF6 1/20 0.61

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7152809 0.98 FFAR1 (0.75) NPC1RAB9ASMN1; SMN2FFAR1PGR
SCHEMBL8737301 0.90 FFAR1 (0.69) NPC1RAB9ASMN1; SMN2FFAR1PGR
SCHEMBL22543145 0.88 NR1H4 (0.78) NPC1RAB9AFFAR1PGRMEN1
SCHEMBL9240473 0.88 PGR (0.84) NPC1RAB9ASMN1; SMN2FFAR1PGR
SCHEMBL94989 0.88 PGR (0.68) NPC1RAB9ASMN1; SMN2FFAR1PGR
SCHEMBL5226157 0.87 NPC1 (1.00) NPC1RAB9ASMN1; SMN2PGRMEN1
SCHEMBL27874895 0.87 NPC1 (0.73) NPC1RAB9ASMN1; SMN2FFAR1MEN1
SCHEMBL6629002 0.85 NPC1 (0.70) NPC1RAB9ASMN1; SMN2FFAR1PGR
SCHEMBL29831035 0.85 NPC1 (0.78) NPC1RAB9ASMN1; SMN2MEN1KMT2A
SCHEMBL8374911 0.85 HDAC1 (0.85) NPC1RAB9ASMN1; SMN2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed