SCHEMBL13601061

SCHEMBL13601061

CC(C)(c1cccc(C(=O)Nc2ccccc2)c1)c1cccc(C(=O)Nc2ccccc2)c1

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LMNA P02545 2/20 0.72
▸ KCNK3 O14649 4/20 0.64
▸ KCNK9 Q9NPC2 4/20 0.63
▸ HDAC8 Q9BY41 2/20 0.61
▸ HDAC6 Q9UBN7 2/20 0.61
▸ HDAC1 Q13547 1/20 0.61
▸ HDAC2 Q92769 1/20 0.61
▸ NR1H4 Q96RI1 1/20 0.60
▸ RAB9A P51151 2/20 0.59
▸ NPC1 O15118 1/20 0.59
▸ SMN1; SMN2 Q16637 1/20 0.59
▸ KMT2A Q03164 4/20 0.57
▸ POLB P06746 2/20 0.57
▸ MEN1 O00255 3/20 0.57
▸ HTT P42858 1/20 0.57
▸ SIRT1 Q96EB6 1/20 0.57
▸ MAPT P10636 1/20 0.56
▸ P2RX1 P51575 1/20 0.55
▸ PTGS1 P23219 1/20 0.55
▸ KDM4E B2RXH2 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12201888 0.90 HDAC8 (0.74) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL4517587 0.84 LMNA (1.00) LMNAKCNK3KCNK9RAB9ANPC1
SCHEMBL30739929 0.84 LMNA (1.00) LMNAKCNK3KCNK9RAB9ANPC1
SCHEMBL8374911 0.82 HDAC1 (0.85) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL13601058 0.81 LMNA (0.78) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL13701743 0.81 HDAC1 (0.66) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL12266428 0.81 KCNK9 (0.82) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL10294662 0.81 KMT2A (0.61) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL8462152 0.80 HDAC6 (0.77) LMNAKCNK3KCNK9HDAC8HDAC6
SCHEMBL14763397 0.80 HDAC6 (0.69) LMNAKCNK3KCNK9HDAC8HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1744213-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEM DUPONT MICROSYS (JP) 2014-09-03 — — EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 — — US disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 — — US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 — — US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 — — US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 — — US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 — — US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 — — US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 — — US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 — — EP disclosed
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