SCHEMBL13616454

SCHEMBL13616454

C1CC(COC2CCC3OC3C2)CCC1COC1CCC2OC2C1

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
CTSL P07711 1/20 0.35
CTSB P07858 1/20 0.35
CTSK P43235 1/20 0.35
JAK2 O60674 1/20 0.32
JAK1 P23458 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17449255 1.00 CTSL (0.35) CTSLCTSBCTSKJAK2JAK1
SCHEMBL11762565 0.94 CTSL (0.31) CTSLCTSBCTSK
SCHEMBL13630606 0.85 CTSL (0.31) CTSLCTSBCTSK
SCHEMBL5383725 0.82
SCHEMBL7879739 0.80 NPC1 (0.30)
SCHEMBL1076015 0.80 TSHR (0.38)
SCHEMBL520788 0.80 PTGS1 (0.32)
SCHEMBL14256307 0.79 CTSL (0.40) CTSLCTSBCTSK
SCHEMBL11790443 0.78 PPM1B (0.35)
SCHEMBL15273575 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090281275-A1 Curable resin compositions and interlayer dielectric films DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2009-11-12 US disclosed