SCHEMBL13627461

SCHEMBL13627461

CC(C)O[Si](C)(C)CCCOC(=O)OCCOCCOC(=O)OCCC[Si](C)(C)OC(C)C

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL230446 0.75 TSHR (0.52)
SCHEMBL229726 0.75 TSHR (0.49)
SCHEMBL11035797 0.75 ALDH1A1 (0.32)
SCHEMBL853573 0.74 ATM (0.41)
SCHEMBL704524 0.71
SCHEMBL28670590 0.71 ALDH1A1 (0.32)
SCHEMBL11129289 0.71 ALDH1A1 (0.34)
SCHEMBL17739865 0.70 MEN1 (0.40) MEN1KMT2A
SCHEMBL22115832 0.70 TSHR (0.54)
SCHEMBL30285286 0.70 TSHR (0.58)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090292075-A1 CURABLE COMPOSITION FOR DAMPING MATERIAL AND DAMPING MATERIAL KANEKA CORPORATION (JP) 2009-11-26 US disclosed
US-7601781-B2 Curable compositions KANEKA CORPORATION (JP) 2009-10-13 US disclosed
US-20080177001-A1 CURABLE COMPOSITIONS KANEKA CORPORATION (JP) 2008-07-24 US disclosed
US-7304108-B2 Polymer, process for producing the polymer, and curable composition containing the polymer KANEKA CORPORATION (JP) 2007-12-04 US disclosed
US-20070276066-A1 Curing Composition KANEKA CORPORATION (JP) 2007-11-29 US disclosed
US-20070135590-A1 Curable composition and cured product thereof KANEKA CORPORATION (JP) 2007-06-14 US disclosed
US-20070004880-A1 Polymer, process for producing the polymer, and curable composition containing the polymer KANEKA CORPORATION (JP) 2007-01-04 US disclosed