SCHEMBL13645899

SCHEMBL13645899

COCn1c(OC)c(OC)n(C(C)=O)c1=O

nearest known ligand 0.33

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ADORA2B P29275 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14591115 0.67 ADORA2B (0.35) ADORA2B
SCHEMBL23348858 0.59 ADORA2B (0.38) ADORA2B
SCHEMBL15143908 0.59 CYP3A4 (0.67) ADORA2B
SCHEMBL24122404 0.58 ADORA2B (0.41) ADORA2B
SCHEMBL23466934 0.57 TP53 (0.69) ADORA2B
SCHEMBL24359401 0.55 ADORA2B (0.46) ADORA2B
SCHEMBL5228776 0.55 TRPA1 (0.33)
SCHEMBL31098080 0.53 APEX1 (0.35)
SCHEMBL24703554 0.52 KDM4E (0.57)
SCHEMBL3314327 0.50 POLB (0.61)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7598009-B2 Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device FUJIFILM CORPORATION (JP) 2009-10-06 US disclosed
US-20090035693-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2009-02-05 US disclosed
US-20080075999-A1 Polyelectrolyte Material, Polyelectrolyte Component, Membrane Electrode Composite Body, and Polyelectrolyte Type Fuel Cell TORAY INDUSTRIES, INC. (JP) 2008-03-27 US disclosed