SCHEMBL136485

SCHEMBL136485

CCCCCCCCCN(CCCCCCCCC)C(=O)OC(C)(C)C

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA14 Q9ULX7 2/20 0.55
CA12 O43570 4/20 0.42
CA1 P00915 4/20 0.42
CA9 Q16790 3/20 0.42
CA2 P00918 1/20 0.42
HDAC1 Q13547 2/20 0.41
HDAC2 Q92769 2/20 0.41
HDAC6 Q9UBN7 1/20 0.41
ZDHHC20 Q5W0Z9 2/20 0.39
ZDHHC2 Q9UIJ5 1/20 0.39
MGLL Q99685 1/20 0.39
CA7 P43166 1/20 0.38
HDAC3 O15379 1/20 0.37
NCOR2 Q9Y618 1/20 0.37
MMP1 P03956 1/20 0.37
MMP2 P08253 1/20 0.37
MMP3 P08254 1/20 0.37
MMP8 P22894 1/20 0.37
DNM1 Q05193 3/20 0.37
L3MBTL1 Q9Y468 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL133198 1.00 CA14 (0.55) CA14CA12CA1CA9CA2
SCHEMBL1962811 1.00 CA14 (0.55) CA14CA12CA1CA9CA2
SCHEMBL140146 1.00 CA14 (0.55) CA14CA12CA1CA9CA2
SCHEMBL14755630 0.98 CA14 (0.54) CA14CA12CA1CA9CA2
SCHEMBL26616523 0.96 CA14 (0.53) CA14CA12CA1CA9CA2
SCHEMBL18163279 0.96 CA14 (0.53) CA14CA12CA1CA9CA2
SCHEMBL8021973 0.94 CA14 (0.54) CA14CA12CA1CA9CA2
SCHEMBL18599054 0.94 CA14 (0.54) CA14CA12CA1CA9CA2
SCHEMBL13527824 0.93 CA14 (0.54) CA14CA12CA1CA9CA2
SCHEMBL15801151 0.93 CA14 (0.54) CA14CA12CA1CA9CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 330 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12306538-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2025-05-20 US disclosed
US-11681222-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2023-06-20 US disclosed
US-11453734-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2022-09-27 US disclosed
US-20220137508-A9 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2022-05-05 US disclosed
US-20210278764-A1 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2021-09-09 US disclosed
US-20210200097-A1 TREATMENT LIQUID AND PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2021-07-01 US disclosed
US-11042094-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2021-06-22 US disclosed
US-11036133-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2021-06-15 US disclosed
US-10962884-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2021-03-30 US disclosed
EP-2414896-B1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-1225480-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-07-24 EP disclosed
US-20020012872-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-31 US disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
US-20020009667-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1164433-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1162506-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-12 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed