SCHEMBL13686685

SCHEMBL13686685

O=C(Nc1nc(NC(=O)Nc2nnn[nH]2)nc(NC(=O)Nc2nnn[nH]2)n1)Nc1nnn[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12057465 0.90 MDM2 (0.33) —
SCHEMBL13411736 0.86 GAA (0.37) —
SCHEMBL10380209 0.78 ALDH1A1 (0.36) —
SCHEMBL13686683 0.78 RAB9A (0.37) —
SCHEMBL10652900 0.75 — —
SCHEMBL13715636 0.75 MDM2 (0.63) —
SCHEMBL13715672 0.75 SMN1; SMN2 (0.57) —
SCHEMBL13411723 0.74 FLT4 (0.41) —
SCHEMBL13411724 0.74 CDK2 (0.37) —
SCHEMBL13446579 0.74 ABL1 (0.40) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9202709-B2 Polishing liquid for metal and polishing method using the same FUJIFILM CORPORATION (JP) 2015-12-01 — — US disclosed
US-9202709-B2 Polishing liquid for metal and polishing method using the same FUJIFILM CORPORATION (JP) 2015-12-01 — — US disclosed
US-20090239380-A1 POLISHING LIQUID FOR METAL AND POLISHING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-09-24 — — US disclosed
US-20090239380-A1 POLISHING LIQUID FOR METAL AND POLISHING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-09-24 — — US disclosed
US-20090088361-A1 CLEANING AGENT FOR SEMICONDUCTOR DEVICE AND CLEANING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-02 — — US disclosed
US-20090088361-A1 CLEANING AGENT FOR SEMICONDUCTOR DEVICE AND CLEANING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-02 — — US disclosed
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