⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13508158 | 0.80 | — | — | |
| SCHEMBL12161147 | 0.78 | PKM (0.34) | — | |
| SCHEMBL12161132 | 0.76 | — | — | |
| SCHEMBL13506676 | 0.70 | — | — | |
| SCHEMBL21789023 | 0.61 | — | — | |
| SCHEMBL12161087 | 0.58 | — | — | |
| SCHEMBL12611263 | 0.56 | PKM (0.32) | — | |
| SCHEMBL14021919 | 0.56 | PKM (0.32) | — | |
| SCHEMBL3844870 | 0.54 | PKM (0.56) | — | |
| SCHEMBL21789026 | 0.54 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7569649-B2 | Film forming composition, insulating film, and electronic device | FUJIFILM CORPORATION (JP) | 2009-08-04 | — | — | US | disclosed |
| US-7569649-B2 | Film forming composition, insulating film, and electronic device | FUJIFILM CORPORATION (JP) | 2009-08-04 | — | — | US | disclosed |
| US-20080227943-A1 | METHOD OF STORING COATING SOLUTION FOR FORMING INTERLAYER INSULATING FILM FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080227943-A1 | METHOD OF STORING COATING SOLUTION FOR FORMING INTERLAYER INSULATING FILM FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080081131-A1 | INSULATING FILM FORMATION PROCESS | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| US-20080081131-A1 | INSULATING FILM FORMATION PROCESS | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| US-20080076850-A1 | PRODUCTION METHOD OF INSULATING FILM, INSULATING FILM, STACKED PRODUCT AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076888-A1 | FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076850-A1 | PRODUCTION METHOD OF INSULATING FILM, INSULATING FILM, STACKED PRODUCT AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076888-A1 | FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076889-A1 | FILM FORMING COMPOSITION, FILM AND INSULATING FILM FORMED FROM THE COMPOSITION, AND ELECTRONIC DEVICE HAVING THE INSULATING FILM | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20080076889-A1 | FILM FORMING COMPOSITION, FILM AND INSULATING FILM FORMED FROM THE COMPOSITION, AND ELECTRONIC DEVICE HAVING THE INSULATING FILM | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20070246684-A1 | Film forming composition | FUJIFILM CORPORATION (JP) | 2007-10-25 | — | — | US | disclosed |
| US-20070246684-A1 | Film forming composition | FUJIFILM CORPORATION (JP) | 2007-10-25 | — | — | US | disclosed |
| US-20070135603-A1 | Film, film forming composition and electronic device having the film | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| US-20070135603-A1 | Film, film forming composition and electronic device having the film | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| US-20070135585-A1 | Film forming composition, insulating film using the composition, and electronic device having the insulating film | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |
| US-20070135585-A1 | Film forming composition, insulating film using the composition, and electronic device having the insulating film | FUJIFILM CORPORATION (JP) | 2007-06-14 | — | — | US | disclosed |