SCHEMBL13764134

SCHEMBL13764134

OC(COc1ccc(C(c2ccc(OCC3CO3)cc2)(C(F)(F)F)C(F)(F)F)cc1)COc1ccc(C(c2ccc(OCC3CO3)cc2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 3/20 0.54
TP53 P04637 3/20 0.54
TSHR P16473 3/20 0.54
MAPT P10636 3/20 0.54
MEN1 O00255 3/20 0.54
KMT2A Q03164 3/20 0.54
ALDH1A1 P00352 3/20 0.54
HIF1A Q16665 3/20 0.54
CYP1A2 P05177 1/20 0.54
PPARG P37231 1/20 0.54
TDP1 Q9NUW8 1/20 0.45
PKM P14618 2/20 0.43
LMNA P02545 2/20 0.43
GAA P10253 1/20 0.43
CYP3A4 P08684 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
SCN1A P35498 1/20 0.38
SCN5A Q14524 1/20 0.38
SCN9A Q15858 1/20 0.38
CACNA1G O43497 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3393471 0.90 HPGD (0.44) HPGDTP53TSHRMAPTMEN1
SCHEMBL195075 0.89 ALDH1A1 (0.66) HPGDTP53TSHRMAPTMEN1
SCHEMBL13385069 0.87 ALDH1A1 (0.57) HPGDTP53TSHRMAPTMEN1
SCHEMBL19194424 0.85 MAPT (0.46) HPGDTP53TSHRMAPTMEN1
SCHEMBL11568438 0.84 KMT2A (0.78) HPGDTP53TSHRMAPTMEN1
SCHEMBL16492078 0.84 KMT2A (0.78) HPGDTP53TSHRMAPTMEN1
SCHEMBL71111 0.84 KMT2A (0.78) HPGDTP53TSHRMAPTMEN1
SCHEMBL3389530 0.83 MEN1 (0.42) HPGDTP53TSHRMAPTMEN1
SCHEMBL15344079 0.82 TDP1 (0.54) HPGDTP53TSHRMAPTMEN1
SCHEMBL10259735 0.82 TDP1 (0.54) HPGDTP53TSHRMAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160333135-A1 CURABLE COMPOSITION DAIKIN INDUSTRIES, LTD. (JP) 2016-11-17 US disclosed
US-7566758-B2 Epoxy resin composition CANON KABUSHIKI KAISHA (JP) 2009-07-28 US disclosed
US-7399502-B2 Discharge orifice is coated with a cured film having epoxy, perfluroralkyl, and alkylsiloxane groups; cationic polymerization catalyst; water repellent agent; film having excellent water-repellency on a substrate surface CANON KABUSHIKI KAISHA (JP) 2008-07-15 US disclosed