SCHEMBL13812467

SCHEMBL13812467

CCOc1ccc(S(=O)(=O)O)c2ccccc12

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.59
ALDH1A1 P00352 5/20 0.59
LMNA P02545 5/20 0.59
HTT P42858 4/20 0.59
MCOLN3 Q8TDD5 1/20 0.59
HPGD P15428 4/20 0.57
MEN1 O00255 2/20 0.57
KMT2A Q03164 2/20 0.57
MAPT P10636 3/20 0.56
GAA P10253 2/20 0.56
HSD17B10 Q99714 2/20 0.56
PKM P14618 1/20 0.56
CRHBP P24387 1/20 0.56
CRHR2 Q13324 1/20 0.56
SMN1; SMN2 Q16637 4/20 0.55
NPSR1 Q6W5P4 2/20 0.55
KDM4E B2RXH2 1/20 0.55
POLB P06746 1/20 0.53
ALOX15 P16050 1/20 0.53
ALOX12 P18054 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3754233 0.98 TSHR (0.58) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL15461584 0.85 TSHR (0.61) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL249761 0.84 SLC2A1 (0.54) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL3759669 0.83 TSHR (0.59) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL11225810 0.82 SLC2A1 (0.55) TSHRLMNAHTTMCOLN3MEN1
SCHEMBL3754232 0.82 TSHR (0.58) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL11337934 0.82 SLC2A1 (0.48) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL11337933 0.82 SLC2A1 (0.48) TSHRALDH1A1LMNAHTTMCOLN3
SCHEMBL2567982 0.81 ALDH1A1 (0.55) TSHRALDH1A1LMNAHTTSMN1; SMN2
SCHEMBL2372535 0.81 ALDH1A1 (0.65) TSHRALDH1A1LMNAHTTMCOLN3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090148791-A1 POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2009-06-11 US disclosed
US-7544461-B2 Near infrared ray activation type positive resin composition KANSAI PAINT CO., LTD. (JP) 2009-06-09 US disclosed
US-20080318159-A1 POSITIVE PHOTOSENSITIVE COMPOSITION FUJIFILM CORPORATION (JP) 2008-12-25 US disclosed
US-7338740-B2 Positive resist composition FUJIFILM CORPORATION (JP) 2008-03-04 US disclosed
US-20070259279-A1 Near Infrared Ray Activation Type Positive Resin Composition KANSAI PAINT CO., LTD. (JP) 2007-11-08 US disclosed
US-7285369-B2 photoresist composition comprising resins that increases solubility in alkali developing solution by the action of an acid and photoacid generators, which exhibits high sensitivity, high resolution and stability FUJIFILM CORPORATION (JP) 2007-10-23 US disclosed
US-7279265-B2 Positive resist composition and pattern formation method using the same FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-7255971-B2 Positive resist composition FUJIFILM CORPORATION (JP) 2007-08-14 US disclosed
US-7252924-B2 Positive resist composition and method of pattern formation using the same FUJIFILM CORPORATION (JP) 2007-08-07 US disclosed
US-7252924-B2 Positive resist composition and method of pattern formation using the same FUJIFILM CORPORATION (JP) 2007-08-07 US disclosed
US-20070128547-A1 POSITIVE RESIST COMPOSITION FUJI PHOTO FILM CO., LTD. 2007-06-07 US disclosed
US-7214467-B2 Photosensitive resin composition FUJIFILM CORPORATION (JP) 2007-05-08 US disclosed
US-7214733-B2 Positive type resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-05-08 US disclosed
US-7198880-B2 Positive resist composition FUJIFILM CORPORATION (JP) 2007-04-03 US disclosed
US-7192681-B2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2007-03-20 US disclosed
US-7179578-B2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 US disclosed
US-7163776-B2 Positive-working resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-01-16 US disclosed
US-7160666-B2 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 2007-01-09 US disclosed
US-20070003871-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2007-01-04 US disclosed
US-7157206-B2 Resin containing an acid-decomposable group such as bis(trifluoromethyl)methanol group, to generate alkali-soluble group, and acid generators selected from fluorine-substituted or non-fluorine substituted aromatic or aliphatic carboxylic acid generators or sulfonic acid generators; microlithography FUJI PHOTO FILM CO., LTD. (JP) 2007-01-02 US disclosed