SCHEMBL13846375

SCHEMBL13846375

COc1ccnc(CSc2nc3ccc(OC(F)F)cc3[nH]2)c1OC

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2C9 P11712 10/20 0.65
CYP3A4 P08684 9/20 0.65
ATP4A P20648 7/20 0.65
ATP4B P51164 7/20 0.65
KDM4E B2RXH2 1/20 0.65
SLC22A2 O15244 1/20 0.65
DDAH1 O94760 1/20 0.65
ALDH1A1 P00352 1/20 0.65
LMNA P02545 1/20 0.65
ABCB1 P08183 1/20 0.65
MAPT P10636 1/20 0.65
HPGD P15428 1/20 0.65
ALOX15 P16050 1/20 0.65
ADRA1A P35348 1/20 0.65
FASN P49327 1/20 0.65
SLC47A2 Q86VL8 1/20 0.65
SLC47A1 Q96FL8 1/20 0.65
ABCG2 Q9UNQ0 1/20 0.65
CYP2E1 P05181 9/20 0.60
CYP2C8 P10632 9/20 0.60

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29693616 1.00 CYP2C9 (0.65) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL29694095 0.92 ATP4A (0.55) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL537800 0.92 ATP4A (0.55) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL10686910 0.90 BRS3 (0.66) CYP2C9CYP3A4CYP2E1CYP2C8CYP2D6
SCHEMBL6882567 0.88 ATP4A (0.63) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL3179008 0.88 ATP4A (0.51) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL6882433 0.87 ATP4A (0.65) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL3177079 0.87 ATP4A (0.50) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL3170408 0.87 ATP4A (0.50) CYP2C9CYP3A4ATP4AATP4BKDM4E
SCHEMBL3170087 0.87 ATP4A (0.50) CYP2C9CYP3A4ATP4AATP4BKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11935803-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-19 US disclosed
CN-112004845-B Resin composition, laminate, semiconductor wafer with resin composition layer, substrate, and semiconductor device 三菱瓦斯化学株式会社 2022-05-31 CN disclosed
US-20210277221-A1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-09-09 US disclosed
EP-3786200-A1 RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-03-03 EP disclosed
CN-112004845-A Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device 三菱瓦斯化学株式会社 2020-11-27 CN disclosed
WO-2009066317-A2 PROCESS FOR THE PREPARATION OF PANTOPRAZOLE SODIUM MACLEODS PHARMACEUTICALS LIMITED (IN) 2009-05-28 WO disclosed