SCHEMBL13864170

SCHEMBL13864170

O=C1C2C3C=CC(C3)C2C(=O)N1CCCCCCCCCCCCN1C(=O)C2C3C=CC(C3)C2C1=O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 1.00
KMT2A Q03164 2/20 1.00
RAB9A P51151 2/20 1.00
ALDH1A1 P00352 8/20 0.96
TSHR P16473 3/20 0.77
HTT P42858 2/20 0.77
USP2 O75604 1/20 0.77
HSD17B10 Q99714 1/20 0.77
MAPK1 P28482 2/20 0.64
KDM4E B2RXH2 2/20 0.64
SMN1; SMN2 Q16637 3/20 0.59
LMNA P02545 1/20 0.59
L3MBTL1 Q9Y468 1/20 0.58
TDP1 Q9NUW8 1/20 0.53
CYP3A4 P08684 1/20 0.50
CYP2C9 P11712 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10014708 0.94 ALDH1A1 (0.92) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL16231138 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL11592112 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL17300529 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL11533142 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL15967771 0.91 HTT (0.87) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL11528094 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL10625208 0.91 MEN1 (0.83) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL20546502 0.91 HTT (0.87) MEN1KMT2ARAB9AALDH1A1TSHR
SCHEMBL13528565 0.90 ALDH1A1 (0.84) MEN1KMT2ARAB9AALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11578202-B2 Liquid compression molding encapsulants HENKEL AG & CO. KGAA (DE) 2023-02-14 US disclosed
US-20210253844-A1 LIQUID COMPRESSION MOLDING ENCAPSULANTS HENKEL AG & CO. KGAA (DE) 2021-08-19 US disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-9865551-B2 Methods to control wafer warpage upon compression molding thereof and articles useful therefor Henkel IP & Holding GmbH (DE) 2018-01-09 US disclosed
US-20170322600-A1 COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH Henkel IP & Holding GmbH (DE) 2017-11-09 US disclosed
US-20170322600-A1 COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH Henkel IP & Holding GmbH (DE) 2017-11-09 US disclosed
US-20170183450-A1 CATIONICALLY CURABLE BENZOXAZINE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2017-06-29 US disclosed
US-20170183450-A1 CATIONICALLY CURABLE BENZOXAZINE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2017-06-29 US disclosed
US-20170131751-A1 COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH HENKEL AG & CO. KGAA (DE) 2017-05-11 US disclosed
US-20170131751-A1 COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH HENKEL AG & CO. KGAA (DE) 2017-05-11 US disclosed
US-20160079187-A1 METHODS TO CONTROL WAFER WARPAGE UPON COMPRESSION MOLDING THEREOF AND ARTICLES USEFUL THEREFOR HENKEL CORPORATION 2016-03-17 US disclosed
US-9263360-B2 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2016-02-16 US disclosed
US-9263360-B2 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2016-02-16 US disclosed
US-20150152260-A1 LIQUID COMPRESSION MODLING ENCAPSULANTS HENKEL CORPORATION 2015-06-04 US disclosed
US-20150152260-A1 LIQUID COMPRESSION MODLING ENCAPSULANTS HENKEL CORPORATION 2015-06-04 US disclosed
US-8847415-B1 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2014-09-30 US disclosed
US-8847415-B1 Liquid compression molding encapsulants Henkel IP & Holding GmbH (DE) 2014-09-30 US disclosed
US-7537839-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2009-05-26 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed
US-7271227-B1 Adhesive compositions free of metallic catalyst HENKEL CORPORATION (US) 2007-09-18 US disclosed