SCHEMBL13870141

SCHEMBL13870141

[N-]=[N+]=Nc1ccc(/C=C/C=C2\CC(O)C/C(=C\C=C\c3ccc(N=[N+]=[N-])cc3)C2=O)cc1

nearest known ligand 0.37

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
▸ USP18 Q9UMW8 1/20 0.37
▸ UCHL5 Q9Y5K5 1/20 0.37
▸ CA1 P00915 1/20 0.35
▸ CA2 P00918 1/20 0.35
▸ CA5A P35218 1/20 0.35
▸ CA9 Q16790 1/20 0.35
▸ CA5B Q9Y2D0 1/20 0.35
▸ TP53 P04637 1/20 0.35
▸ DNMT1 P26358 1/20 0.34
▸ TXNRD1 Q16881 3/20 0.34
▸ SLC6A3 Q01959 1/20 0.32
▸ RAD51 Q06609 1/20 0.32
▸ MIF P14174 1/20 0.31
▸ PTGS2 P35354 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30382557 0.94 USP18 (0.34) USP18UCHL5CA1CA2CA5A
SCHEMBL18920870 0.87 MAPT (0.38) CA1CA2CA5ACA9CA5B
SCHEMBL18920871 0.87 MAPT (0.38) CA1CA2CA5ACA9CA5B
SCHEMBL13886822 0.87 CA1 (0.35) CA1CA2CA5ACA9CA5B
SCHEMBL13886823 0.87 MAPT (0.38) CA1CA2CA5ACA9CA5B
SCHEMBL13870140 0.86 F10 (0.41) CA1CA2CA5ACA9CA5B
SCHEMBL13886821 0.86 CA1 (0.34) CA1CA2CA5ACA9CA5B
SCHEMBL13886919 0.83 USP18 (0.54) USP18UCHL5CA1CA2CA5A
SCHEMBL25401542 0.82 DNMT1 (0.39) CA1CA2CA5ACA9CA5B
SCHEMBL30384295 0.81 DNMT1 (0.32) DNMT1TXNRD1SLC6A3PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7521744-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. (JP) 2009-04-21 — — US disclosed
US-7521744-B2 Resin-encapsulated semiconductor apparatus and process for its fabrication RENESAS TECHNOLOGY CORP. (JP) 2009-04-21 — — US disclosed
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