SCHEMBL18920871

SCHEMBL18920871

CC1CC(=CC=Cc2ccc(N=[N+]=[N-])cc2)C(=O)C(=CC=Cc2ccc(N=[N+]=[N-])cc2)C1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 6/20 0.38
▸ NPC1 O15118 4/20 0.38
▸ RAB9A P51151 4/20 0.38
▸ MAPK1 P28482 3/20 0.38
▸ HTT P42858 3/20 0.38
▸ HSP90AA1 P07900 1/20 0.38
▸ MEN1 O00255 4/20 0.35
▸ KMT2A Q03164 4/20 0.35
▸ ALDH1A1 P00352 3/20 0.35
▸ PKM P14618 2/20 0.35
▸ KDM4E B2RXH2 2/20 0.35
▸ NPSR1 Q6W5P4 2/20 0.35
▸ XBP1 P17861 1/20 0.35
▸ SMN1; SMN2 Q16637 1/20 0.35
▸ CA1 P00915 1/20 0.35
▸ CA2 P00918 1/20 0.35
▸ CA5A P35218 1/20 0.35
▸ CA9 Q16790 1/20 0.35
▸ CA5B Q9Y2D0 1/20 0.35
▸ LMNA P02545 4/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18920870 1.00 MAPT (0.38) MAPTNPC1RAB9AMAPK1HTT
SCHEMBL13886823 1.00 MAPT (0.38) MAPTNPC1RAB9AMAPK1HTT
SCHEMBL29112208 0.90 NPC1 (0.32) MAPTNPC1RAB9AMAPK1HTT
SCHEMBL13870141 0.87 USP18 (0.37) CA1CA2CA5ACA9CA5B
SCHEMBL13886822 0.87 CA1 (0.35) CA1CA2CA5ACA9CA5B
SCHEMBL13886821 0.86 CA1 (0.34) CA1CA2CA5ACA9CA5B
SCHEMBL28392156 0.85 TXNRD1 (0.34) TXNRD1DNMT1SLC6A3SMOPTGS2
SCHEMBL30382557 0.84 USP18 (0.34) MEN1KMT2ACA1CA2CA5A
SCHEMBL13870140 0.84 F10 (0.41) CA1CA2CA5ACA9CA5B
SCHEMBL13886925 0.83 MAPT (0.55) MAPTNPC1RAB9AMAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117111405-B Preparation of linear polysiloxane low dielectric loss photosensitive resin and application of photoetching patterning 西南科技大学 2024-09-24 — — CN claimed
CN-117111405-A Preparation of linear polysiloxane low dielectric loss photosensitive resin and application of photoetching patterning 西南科技大学 2023-11-24 — — CN claimed
CN-116880126-A Preparation and application of branched benzocyclobutenyl polysiloxane low dielectric loss photosensitive resin 西南科技大学 2023-10-13 — — CN claimed
EP-4245423-B1 FILM FORMING APPARATUS, ELECTRODE, ELECTROCHEMICAL ELEMENT, AND FILM FORMING METHOD RICOH CO LTD (JP) 2026-04-29 — — EP disclosed
EP-3593390-B1 FILM ELECTRODE, RESIN LAYER FORMING INK AND ELECTRODE PRINTING METHOD RICOH CO LTD (JP) 2025-09-17 — — EP disclosed
US-12406976-B2 Electrode manufacturing method RICOH COMPANY, LTD. (JP) 2025-09-02 — — US disclosed
EP-4567936-A2 FILM ELECTRODE, RESIN LAYER FORMING INK AND ELECTRODE PRINTING METHOD Ricoh Company, Ltd. (JP) 2025-06-11 — — EP disclosed
US-20250183483-A1 METHOD OF MANUFACTURING LAMINATE FOR BATTERY, APPARATUS FOR MANUFACTURING LAMINATE FOR BATTERY, METHOD OF MANUFACTURING MEMBER FOR BATTERY, AND APPARATUS FOR MANUFACTURING MEMBER FOR BATTERY RICOH COMPANY, LTD. (JP) 2025-06-05 — — US disclosed
EP-4494208-A1 METHOD OF MANUFACTURING LAMINATE FOR BATTERY, APPARATUS FOR MANUFACTURING LAMINATE FOR BATTERY, METHOD OF MANUFACTURING MEMBER FOR BATTERY, AND APPARATUS FOR MANUFACTURING MEMBER FOR BATTERY Ricoh Company, Ltd. (JP) 2025-01-22 — — EP disclosed
WO-2024204831-A1 COMPOSITION LIQUID FOR SURFACE TREATMENT, AND METHOD FOR PRODUCING SURFACE TREATMENT SUBSTANCE, METAL-COATED RESIN, RESIN LAMINATE, AND RESIN-COATED SUBSTANCE 豊光社テクノロジーズ株式会社 2024-10-03 — — WO disclosed
CN-117111405-B Preparation of linear polysiloxane low dielectric loss photosensitive resin and application of photoetching patterning 西南科技大学 2024-09-24 — — CN disclosed
US-20230091130-A1 FILM ELECTRODE, RESIN LAYER FORMING INK, INORGANIC LAYER FORMING INK, AND ELECTRODE PRINTING APPARATUS RICOH COMPANY, LTD. (JP) 2023-03-23 — — US disclosed
US-11588147-B2 Film electrode, resin layer forming ink, inorganic layer forming ink, and electrode printing apparatus RICOH COMPANY, LTD. (JP) 2023-02-21 — — US disclosed
US-20230028756-A1 ELECTRODE MANUFACTURING APPARATUS, ENERGY STORAGE DEVICE MANUFACTURING APPARATUS, LIQUID DISCHARGE APPARATUS, ELECTRODE MANUFACTURING METHOD, AND RECORDING MEDIUM RICOH COMPANY, LTD. (JP) 2023-01-26 — — US disclosed
EP-4120425-A1 ELECTRODE MANUFACTURING APPARATUS, ENERGY STORAGE DEVICE MANUFACTURING APPARATUS, LIQUID DISCHARGE APPARATUS, ELECTRODE MANUFACTURING METHOD, AND PROGRAM Ricoh Company, Ltd. (JP) 2023-01-18 — — EP disclosed
CN-108367289-B Method for producing a plurality of measurement regions on a chip and chip having a plurality of measurement regions 勃林格殷格翰维特梅迪卡有限公司 2022-01-18 — — CN disclosed
US-20200119333-A1 FILM ELECTRODE, RESIN LAYER FORMING INK, INORGANIC LAYER FORMING INK, AND ELECTRODE PRINTING APPARATUS RICOH COMPANY, LTD. (JP) 2020-04-16 — — US disclosed
EP-3383537-A1 METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP AND CHIP HAVING A PLURALITY OF MEASUREMENT REGIONS Boehringer Ingelheim Vetmedica GmbH (DE) 2018-10-10 — — EP disclosed
WO-2018164076-A1 FILM ELECTRODE, RESIN LAYER FORMING INK, INORGANIC LAYER FORMING INK, AND ELECTRODE PRINTING APPARATUS RICOH COMPANY, LTD. (JP) 2018-09-13 — — WO disclosed
WO-2017092875-A1 METHOD FOR PRODUCING A PLURALITY OF MEASUREMENT REGIONS ON A CHIP AND CHIP HAVING A PLURALITY OF MEASUREMENT REGIONS BOEHRINGER INGELHEIM VETMEDICA GMBH (DE) 2017-06-08 — — WO disclosed
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