SCHEMBL13878433

SCHEMBL13878433

CC(=O)c1cccc(C(=O)Nc2ccc(NC(=O)c3cccc(C(C)=O)c3)cc2)c1

nearest known ligand 0.76

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 9/20 0.76
POLB P06746 2/20 0.76
MEN1 O00255 8/20 0.68
TP53 P04637 1/20 0.68
RXFP1 Q9HBX9 2/20 0.66
NPC1 O15118 3/20 0.64
RAB9A P51151 3/20 0.64
ALDH1A1 P00352 3/20 0.64
MAPK1 P28482 1/20 0.63
SMN1; SMN2 Q16637 1/20 0.63
NPSR1 Q6W5P4 1/20 0.63
THRB P10828 1/20 0.62
KCNK3 O14649 1/20 0.61
KCNH2 Q12809 1/20 0.61
KCNK9 Q9NPC2 1/20 0.61
HDAC1 Q13547 1/20 0.61
HDAC2 Q92769 1/20 0.61
HDAC8 Q9BY41 1/20 0.61
HDAC6 Q9UBN7 1/20 0.61
HPGD P15428 1/20 0.60

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5973949 0.89 L3MBTL1 (0.70) KMT2APOLBMEN1TP53RXFP1
SCHEMBL5974770 0.89 KMT2A (0.73) KMT2APOLBMEN1RXFP1NPC1
SCHEMBL12790990 0.87 KMT2A (0.65) KMT2APOLBMEN1TP53RXFP1
SCHEMBL10035665 0.87 TIMP3 (0.62) KMT2APOLBMEN1TP53RXFP1
SCHEMBL1630322 0.86 KMT2A (0.63) KMT2APOLBMEN1RXFP1NPC1
SCHEMBL13023383 0.85 HDAC3 (0.60) KMT2APOLBMEN1RXFP1NPC1
SCHEMBL13210704 0.85 KMT2A (0.81) KMT2APOLBMEN1NPC1RAB9A
SCHEMBL14715851 0.84 KMT2A (0.79) KMT2APOLBMEN1TP53NPC1
SCHEMBL5973851 0.84 NPC1 (0.65) KMT2APOLBMEN1TP53RXFP1
SCHEMBL10035675 0.84 KMT2A (0.57) KMT2APOLBMEN1RXFP1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090111050-A1 Novel Photosensitive Resin Compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2009-04-30 US disclosed