Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 4/20 | 0.43 |
| ▸ | CA9 | Q16790 | 4/20 | 0.43 |
| ▸ | CA2 | P00918 | 3/20 | 0.43 |
| ▸ | HTR1A | P08908 | 1/20 | 0.41 |
| ▸ | CA1 | P00915 | 4/20 | 0.40 |
| ▸ | DRD2 | P14416 | 4/20 | 0.39 |
| ▸ | DRD3 | P35462 | 4/20 | 0.39 |
| ▸ | DRD1 | P21728 | 2/20 | 0.39 |
| ▸ | DRD4 | P21917 | 2/20 | 0.39 |
| ▸ | DRD5 | P21918 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.39 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.39 |
| ▸ | ADRA1D | P25100 | 1/20 | 0.39 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.39 |
| ▸ | ADRA1B | P35368 | 1/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.39 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.39 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL139782 | 1.00 | CA12 (0.43) | CA12CA9CA2HTR1ACA1 | |
| Methyl Alcohol SCHEMBL3067486 | 0.92 | CA12 (0.43) | CA12CA9CA2HTR1ACA1 | |
| SCHEMBL5358 | 0.91 | HRH3 (0.41) | CA12CA9CA2HTR1ACA1 | |
| SCHEMBL2729745 | 0.91 | HRH3 (0.41) | CA12CA9CA2HTR1ACA1 | |
| SCHEMBL21224483 | 0.91 | HRH3 (0.41) | CA12CA9CA2HTR1ACA1 | |
| Bicarbonate SCHEMBL5875239 | 0.89 | CA12 (0.50) | CA12CA9CA2HTR1ACA1 | |
| Bicarbonate SCHEMBL5875232 | 0.89 | CA12 (0.50) | CA12CA9CA2HTR1ACA1 | |
| Alcohol SCHEMBL13280379 | 0.88 | TSHR (0.46) | CA12CA9CA2HTR1ACA1 | |
| Methyl Alcohol SCHEMBL11583118 | 0.88 | CA12 (0.41) | CA12CA9CA2HTR1ACA1 | |
| Methyl Alcohol SCHEMBL11567436 | 0.88 | CA12 (0.41) | CA12CA9CA2HTR1ACA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107735854-B | Sinterable adhesive material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-12-15 | — | — | CN | disclosed |
| CN-107112246-B | Sinterable bonding material and semiconductor device using same | 汉高股份有限及两合公司 | 2020-11-10 | — | — | CN | disclosed |
| EP-3238238-B1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | HENKEL AG & CO KGAA (DE) | 2020-10-28 | — | — | EP | disclosed |
| EP-3708389-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | Moon, Dae Yong (KR) | 2020-09-16 | — | — | EP | disclosed |
| US-20200262249-A1 | TIRE STUD AND MANUFACTURING METHOD THEREFOR | MUN DAE YONG (KR) | 2020-08-20 | — | — | US | disclosed |
| US-10446518-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2019-10-15 | — | — | US | disclosed |
| US-10141283-B2 | Sinterable bonding material and semiconductor device using the same | HENKEL AG & CO. KGAA (DE) | 2018-11-27 | — | — | US | disclosed |
| CN-107735854-A | Sinterable jointing material and use its semiconductor device | 汉高股份有限及两合公司 | 2018-02-23 | — | — | CN | disclosed |
| EP-3238239-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| EP-3238238-A1 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | Henkel AG & Co. KGaA (DE) | 2017-11-01 | — | — | EP | disclosed |
| US-8950652-B2 | Metal paste with oxidizing agents | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-02-10 | — | — | US | disclosed |
| US-20150021378-A1 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS | Heraeus Deutschland GmbH & Co. KG (DE) | 2015-01-22 | — | — | US | disclosed |
| US-8925789-B2 | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2015-01-06 | — | — | US | disclosed |
| CN-102386149-B | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2014-12-03 | — | — | CN | disclosed |
| EP-2396140-B1 | METAL PASTE WITH OXIDATION AGENTS | HERAEUS MATERIALS TECH GMBH (DE) | 2013-01-16 | — | — | EP | disclosed |
| CN-102596486-A | Metal paste with oxidation agents | HERAEUS MATERIALS TECH GMBH | 2012-07-18 | — | — | CN | disclosed |
| US-20120153011-A1 | METAL PASTE WITH OXIDIZING AGENTS | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-06-21 | — | — | US | disclosed |
| CN-102386149-A | Contacting means and method for contacting electrical components | HERAEUS MATERIALS TECH GMBH | 2012-03-21 | — | — | CN | disclosed |
| EP-2428293-A2 | Contacting medium and process for contacting electrical parts | Heraeus Materials Technology GmbH & Co. KG (DE) | 2012-03-14 | — | — | EP | disclosed |
| US-20120055978-A1 | Contacting Means and Method for Contacting Electrical Components | HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) | 2012-03-08 | — | — | US | disclosed |