SCHEMBL14060779

SCHEMBL14060779

Cc1[nH]c(-c2cccs2)nc1-c1ccccc1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.70
MAPT P10636 7/20 0.70
HPGD P15428 7/20 0.70
ALDH1A1 P00352 6/20 0.70
MEN1 O00255 3/20 0.70
KMT2A Q03164 3/20 0.70
CYP1A2 P05177 1/20 0.70
CYP3A4 P08684 1/20 0.70
CYP2C9 P11712 1/20 0.70
CYP2C19 P33261 1/20 0.70
PPARG P37231 1/20 0.70
NCOA2 Q15596 1/20 0.70
NCOA1 Q15788 1/20 0.70
LMNA P02545 3/20 0.54
SMN1; SMN2 Q16637 3/20 0.54
HTT P42858 2/20 0.54
SMPD3 Q9NY59 7/20 0.53
PDE10A Q9Y233 1/20 0.53
NPSR1 Q6W5P4 1/20 0.50
NPY5R Q15761 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14334457 0.88 SMPD3 (0.62) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14334168 0.87 SMPD3 (0.60) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14060238 0.87 NPY5R (0.56) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14059768 0.84 MAPT (0.51) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL31305458 0.84 MAPT (0.51) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14334000 0.84 MAPT (0.50) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14059819 0.83 NPY5R (0.60) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14059826 0.83 KDM4E (1.00) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14059778 0.82 SMPD3 (0.51) KDM4EMAPTHPGDALDH1A1MEN1
SCHEMBL14060454 0.80 MAPK14 (0.50) KDM4EMAPTHPGDALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
US-10398028-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2019-08-27 US disclosed
US-10398028-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2019-08-27 US disclosed
US-20170064823-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2017-03-02 US disclosed
US-20170064823-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2017-03-02 US disclosed
US-20170064823-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2017-03-02 US disclosed
US-9532493-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2016-12-27 US disclosed
US-9532493-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2016-12-27 US disclosed
CN-103547706-B Surface treatment composition for copper and copper alloy and use thereof 四国化成工业株式会社 2016-09-28 CN disclosed
EP-2714962-B1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEM (JP) 2015-07-08 EP disclosed
US-20140097231-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2014-04-10 US disclosed
CN-103547706-A Surface treatment composition for copper and copper alloy and use thereof SHIKOKU CHEM 2014-01-29 CN disclosed
WO-2012161341-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2012-11-29 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10398028-B2 Surface treating composition for copper and copper alloy and utilization thereof SOD1, SOD3, AOC3 KDM4E 3649/4885MAPT 374/4885HPGD 1126/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.