SCHEMBL1412958

SCHEMBL1412958

CO[Si](OC)(OC)[SiH2]CCCOCC1CO1

nearest known ligand 0.55

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.55
SMN1; SMN2 Q16637 1/20 0.53
ALDH1A1 P00352 4/20 0.50
TDP1 Q9NUW8 1/20 0.50
MAPK1 P28482 1/20 0.38
TP53 P04637 1/20 0.31
CYP3A4 P08684 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28058427 0.84 SMN1; SMN2 (0.54) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL464858 0.78 TSHR (0.52) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL150450 0.77 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL5522882 0.77 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL4321971 0.77 TSHR (0.65) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL19125756 0.76 TSHR (0.64) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL4810333 0.75 TSHR (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL7215607 0.75 TSHR (0.57) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL27467187 0.75 TSHR (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL8002488 0.75 TSHR (0.57) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230118543-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2023-04-20 US disclosed
EP-4100794-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF Hewlett-Packard Development Company L.P. (US) 2022-12-14 EP disclosed
US-20220390880-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2022-12-08 US disclosed
EP-3999915-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF Hewlett-Packard Development Company, L.P. (US) 2022-05-25 EP disclosed
US-20220050406-A1 METHOD OF REFURBISHING AN INTERMEDIATE TRANSFER MEMBER HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2022-02-17 US disclosed
WO-2021201860-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-10-07 WO disclosed
WO-2021201861-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2021-10-07 WO disclosed
WO-2020246979-A1 METHOD OF REFURBISHING AN INTERMEDIATE TRANSFER MEMBER HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2020-12-10 WO disclosed
US-20200150564-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HP INDIGO B.V. (NL) 2020-05-14 US disclosed
US-20200125009-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2020-04-23 US disclosed
EP-3610333-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HP Indigo B.V. (NL) 2020-02-19 EP disclosed
WO-2019074541-A1 INTERMEDIATE TRANSFER MEMBER AND METHOD OF PRODUCTION THEREOF HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2019-04-18 WO disclosed
EP-2683556-B1 INTERMEDIATE TRANSFER MEMBERS HEWLETT PACKARD DEVELOPMENT CO LP (US) 2017-05-31 EP disclosed
CN-105820445-A Fungi-proofing pipe and manufacturing method thereof 漳州仂元工业有限公司 2016-08-03 CN disclosed
EP-2683556-A1 INTERMEDIATE TRANSFER MEMBERS Hewlett-Packard Development Company, L.P. (US) 2014-01-15 EP disclosed
US-20130337184-A1 INTERMEDIATE TRANSFER MEMBERS HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2013-12-19 US disclosed
WO-2012121702-A1 INTERMEDIATE TRANSFER MEMBERS HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2012-09-13 WO disclosed
EP-2095191-B1 INTERMEDIATE TRANSFER MEMBER AND METHOD FOR MAKING SAME HEWLETT PACKARD DEVELOPMENT CO (US) 2011-03-16 EP disclosed
US-7754298-B2 producing an intermediate transfer member for digital offset printing; applying UV irradiation to the coated primer to bond the silicone release layer to the rubber layer, coupling with methacryloxypropyl trimethoxysilane to increase adhesion HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2010-07-13 US disclosed
US-20080138546-A1 producing an intermediate transfer member for digital offset printing; applying UV irradiation to the coated primer to bond the silicone release layer to the rubber layer, coupling with methacryloxypropyl trimethoxysilane to increase adhesion HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 2008-06-12 US disclosed