Isopropylamine

Isopropylamine

SCHEMBL141429

CC(C)N.CC(C)N.OO

nearest known ligand 0.44

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC7A5 Q01650 2/20 0.44
ALDH1A1 P00352 3/20 0.40
LMNA P02545 2/20 0.40
GABRP O00591 4/20 0.37
GABRD O14764 4/20 0.37
GABRA1 P14867 4/20 0.37
GABRB1 P18505 4/20 0.37
GABRG2 P18507 4/20 0.37
GABRB3 P28472 4/20 0.37
GABRA5 P31644 4/20 0.37
GABRA3 P34903 4/20 0.37
GABRA2 P47869 4/20 0.37
GABRB2 P47870 4/20 0.37
GABRA4 P48169 4/20 0.37
GABRE P78334 4/20 0.37
GABRA6 Q16445 4/20 0.37
GABRG1 Q8N1C3 4/20 0.37
GABRG3 Q99928 4/20 0.37
GABRQ Q9UN88 4/20 0.37
TP53 P04637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Isopropylamine SCHEMBL141428 1.00
Isopropylamine SCHEMBL3988067 0.88
Isopropylamine SCHEMBL30440281 0.87
Isopropylamine SCHEMBL19813885 0.87
Isopropylamine SCHEMBL2909 0.87
Benzene SCHEMBL5919597 0.85 ADRA2A (0.41) SLC7A5ALDH1A1LMNAGABRPGABRD
Isopropylamine SCHEMBL910225 0.85
Isopropylamine SCHEMBL3215229 0.82
Benzene SCHEMBL8083198 0.82 SLC6A2 (0.40) ALDH1A1LMNAADRA2AADRA2CHIF1A
Isopropylamine SCHEMBL8068212 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107735854-B Sinterable adhesive material and semiconductor device using same 汉高股份有限及两合公司 2020-12-15 CN disclosed
CN-107112246-B Sinterable bonding material and semiconductor device using same 汉高股份有限及两合公司 2020-11-10 CN disclosed
EP-3238238-B1 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME HENKEL AG & CO KGAA (DE) 2020-10-28 EP disclosed
EP-3708389-A1 TIRE STUD AND MANUFACTURING METHOD THEREFOR Moon, Dae Yong (KR) 2020-09-16 EP disclosed
US-20200262249-A1 TIRE STUD AND MANUFACTURING METHOD THEREFOR MUN DAE YONG (KR) 2020-08-20 US disclosed
US-10446518-B2 Sinterable bonding material and semiconductor device using the same HENKEL AG & CO. KGAA (DE) 2019-10-15 US disclosed
US-10141283-B2 Sinterable bonding material and semiconductor device using the same HENKEL AG & CO. KGAA (DE) 2018-11-27 US disclosed
EP-3238238-A1 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME Henkel AG & Co. KGaA (DE) 2017-11-01 EP disclosed
EP-3238239-A1 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME Henkel AG & Co. KGaA (DE) 2017-11-01 EP disclosed
US-20170294396-A1 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME HENKEL AG & CO. KGAA (DE) 2017-10-12 US disclosed
US-20170294404-A1 SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME HENKEL AG & CO. KGAA (DE) 2017-10-12 US disclosed
US-8950652-B2 Metal paste with oxidizing agents HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) 2015-02-10 US disclosed
US-20150021378-A1 METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS Heraeus Deutschland GmbH & Co. KG (DE) 2015-01-22 US disclosed
US-8925789-B2 Contacting means and method for contacting electrical components HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) 2015-01-06 US disclosed
US-20120153011-A1 METAL PASTE WITH OXIDIZING AGENTS HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) 2012-06-21 US disclosed
US-20120055978-A1 Contacting Means and Method for Contacting Electrical Components HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG (DE) 2012-03-08 US disclosed