SCHEMBL1425819

SCHEMBL1425819

CC(S)CS(=O)(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1578146 0.97
SCHEMBL8046440 0.97
Ammonia Solution, Strong SCHEMBL11866686 0.79 SLC22A6 (0.44)
SCHEMBL8936510 0.78 SLC22A6 (0.48)
SCHEMBL8896709 0.75 SLC22A6 (0.57)
SCHEMBL5374 0.75
SCHEMBL28070675 0.75 SLC22A6 (0.43)
SCHEMBL3944296 0.75
SCHEMBL10708540 0.75 SLC22A6 (0.43)
SCHEMBL3421787 0.75 SLC22A6 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119307986-A Method for manufacturing electrolytic copper foil with high elongation characteristic after high-temperature heat treatment 陕西未来尖端材料科技有限公司 2025-01-14 CN claimed
CN-119019232-A Preparation method of diether fluorene based on continuous flow reaction 陕西煤基特种燃料研究院有限公司 2024-11-26 CN claimed
CN-114277413-B Copper plating solution for circuit board 广东利尔化学有限公司 2024-05-17 CN claimed
CN-117510385-A Chain transfer agent for polycarboxylate superplasticizer, application and preparation method thereof 科之杰新材料集团(贵州)有限公司 2024-02-06 CN claimed
CN-115198309-A Electrolysis method for purifying low-silver low-sulfur ultra-high-purity copper 江苏鑫瑞崚新材料科技有限公司 2022-10-18 CN claimed
CN-112225646-B Preparation method of bisphenol TMC 万华化学集团股份有限公司 2022-07-12 CN claimed
CN-114014788-A Chain transfer agent for polycarboxylate superplasticizer, application and preparation method thereof 科之杰新材料集团(贵州)有限公司 2022-02-08 CN claimed
CN-112225646-A Preparation method of bisphenol TMC 万华化学集团股份有限公司 2021-01-15 CN claimed
US-10577704-B2 Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same METALOR TECHNOLOGIES CORPORATION (JP) 2020-03-03 US claimed
CN-119307986-A Method for manufacturing electrolytic copper foil with high elongation characteristic after high-temperature heat treatment 陕西未来尖端材料科技有限公司 2025-01-14 CN disclosed
CN-119019232-A Preparation method of diether fluorene based on continuous flow reaction 陕西煤基特种燃料研究院有限公司 2024-11-26 CN disclosed
EP-3730638-B1 A SINTERED BODY DAINIPPON INK & CHEMICALS (JP) 2024-08-14 EP disclosed
CN-114277413-B Copper plating solution for circuit board 广东利尔化学有限公司 2024-05-17 CN disclosed
CN-117510385-A Chain transfer agent for polycarboxylate superplasticizer, application and preparation method thereof 科之杰新材料集团(贵州)有限公司 2024-02-06 CN disclosed
EP-0981344-A1 INHIBITION OF CELL SURFACE PROTEIN DISULFIDE ISOMERASE The University of New Mexico (US) 2000-03-01 EP disclosed
WO-1998051297-A1 INHIBITION OF CELL SURFACE PROTEIN DISULFIDE ISOMERASE THE UNIVERSITY OF NEW MEXICO (US) 1998-11-19 WO disclosed
EP-0524804-B1 Surface modified liposomes BECTON DICKINSON CO (US) 1997-05-14 EP disclosed
US-5248590-A Surface modified liposomes BECTON, DICKINSON AND COMPANY (US) 1993-09-28 US disclosed
EP-0524804-A2 Surface modified liposomes Becton, Dickinson and Company (US) 1993-01-27 EP disclosed
US-4070188-A One bath type silver dye bleaching and silver bleaching FUJI PHOTO FILM CO., LTD. (JA) 1978-01-24 US disclosed