SCHEMBL3944296

SCHEMBL3944296

O=S(=O)(O)CC(S)S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27415072 0.97
SCHEMBL8896709 0.80 SLC22A6 (0.57)
SCHEMBL27821301 0.78
SCHEMBL1425819 0.75
SCHEMBL6772028 0.75
2,3-Dimercapto-1-Propanesulfonic Acid SCHEMBL17744957 0.73
2,3-Dimercapto-1-Propanesulfonic Acid SCHEMBL20483588 0.73
SCHEMBL1578146 0.73
2,3-Dimercapto-1-Propanesulfonic Acid SCHEMBL135293 0.73
SCHEMBL8046440 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114514340-A Differential contrast plating for advanced packaging applications 朗姆研究公司 2022-05-17 CN claimed
CN-114514340-B Differential contrast plating for advanced packaging applications 朗姆研究公司 2025-03-21 CN disclosed
CN-112135930-B Copper electrical fill on non-copper liner layer 朗姆研究公司 2024-10-29 CN disclosed
CN-116134182-A Electroplated nano-bicrystal and non-nano-bicrystal copper features 朗姆研究公司 2023-05-16 CN disclosed
CN-115053326-A Photoresist free electrohydrodynamic jet printing and plating for metal features 朗姆研究公司 2022-09-13 CN disclosed
CN-114930502-A Improving TSV processing window and fill performance through long pulsing and ramping 朗姆研究公司 2022-08-19 CN disclosed
CN-114514340-A Differential contrast plating for advanced packaging applications 朗姆研究公司 2022-05-17 CN disclosed
CN-113260739-A Electrodeposition of nano-twin copper structures 朗姆研究公司 2021-08-13 CN disclosed
CN-111247633-A Multiple bath plating of single metals 朗姆研究公司 2020-06-05 CN disclosed
WO-2009022430-A1 SKIN WHITENING AGENT KI PHARMACEUTICALS, INC. (JP) 2009-02-19 WO disclosed
US-7449098-B1 Selective acceleration planarization: accelerator deposited on a plated surface and mechanically removed; wafer then plated in an electrolyte containing little or no accelerating additives; elimination of need to continually remove the additive from the exposed regions during plating NOVELLUS SYSTEMS, INC. (US) 2008-11-11 US disclosed
CN-1165483-A Composition of cisplatin and 2,2' -dithio-bis (ethanesulfonate) (dimercaptoethanesulfonic acid sodium salt) BIONUMEIK PHARMACEUTICALS INC (US) 1997-11-19 CN disclosed