SCHEMBL142907

SCHEMBL142907

Cc1c(O)c(N)c(CC2CO2)c(CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3156273 0.89
SCHEMBL25400687 0.87
SCHEMBL3461600 0.86
SCHEMBL3180847 0.85
SCHEMBL6658126 0.82
SCHEMBL7665254 0.81
SCHEMBL11575280 0.79
SCHEMBL8026352 0.78 ALDH1A1 (0.33)
SCHEMBL2699222 0.77
SCHEMBL21114057 0.76 ALDH1A1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122071604-A Epoxy resin composition, cured product, and joined body 柯尼卡美能达株式会社 2026-05-22 CN disclosed
CN-119137219-A Thermosetting resin composition and cured product 宝理塑料赢创有限公司 2024-12-13 CN disclosed
CN-114729133-B Method for forming fiber reinforced composite material and epoxy resin composition used therein 东丽株式会社 2024-09-20 CN disclosed
CN-118382671-A Method for treating fiber reinforced composite material 西恩斯科公司 2024-07-23 CN disclosed
CN-117980415-A Thermosetting resin composition and thermosetting article 宝理塑料赢创有限公司 2024-05-03 CN disclosed
CN-117980416-A Thermosetting resin composition and cured product 宝理塑料赢创有限公司 2024-05-03 CN disclosed
CN-117924667-A Curable resin composition and fiber reinforced resin matrix composite 塞特工业公司 2024-04-26 CN disclosed
CN-111278885-B Curable resin composition and fiber reinforced resin matrix composite 塞特工业公司 2024-03-22 CN disclosed
CN-114641396-B Ink jet head and method for manufacturing the same 柯尼卡美能达株式会社 2024-03-08 CN disclosed
CN-111936681-B Carbon fiber bundle, method for producing same, prepreg, and carbon fiber-reinforced composite material 东丽株式会社 2023-05-16 CN disclosed
EP-3075785-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME Toho Tenax Co., Ltd. (JP) 2016-10-05 EP disclosed
US-20160280871-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME TOHO TENAX CO., LTD. (JP) 2016-09-29 US disclosed
US-20150030791-A1 FIBER-REINFORCED COMPOSITE SHEET AND INTEGRATED MOLDING TORAY INDUSTRIES (JP) 2015-01-29 US disclosed
US-8877330-B2 Fiber-reinforced composite sheet TORAY INDUSTRIES, INC. (JP) 2014-11-04 US disclosed
EP-2543693-A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment Toray Industries, Inc. (JP) 2013-01-09 EP disclosed
CN-102863742-A Thermosetting resin composition and application thereof CHI MEI CORP 2013-01-09 CN disclosed
US-20120058325-A1 Fiber-reinforced composite sheet HONMA MASATO (JP) 2012-03-08 US disclosed
US-8021752-B2 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, fiber-reinforced composite sheet, and casing for electrical/electronic equipment TORAY INDUSTRIES, INC. (JP) 2011-09-20 US disclosed
US-20080166511-A1 Epoxy Resin Composition for Carbon-Fiber-Reinforced Composite Material, Prepreg, Integrated Molding, Fiber-Reinforced Composite Sheet, and Casing for Electrical/Electronic Equipment TORAY INDUSTRIES INC. (JP) 2008-07-10 US disclosed
EP-1731553-A1 EPOXY RESIN COMPOSITION FOR CARBON-FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, INTEGRATED MOLDING, SHEET OF FIBER-REINFORCED COMPOSITE MATERIAL AND CABINET FOR ELECTRICAL/ELECTRONIC EQUIPMENT TORAY INDUSTRIES, INC. (JP) 2006-12-13 EP disclosed