SCHEMBL8026352

SCHEMBL8026352

Nc1c(N)c(CC2CO2)c(CC2CO2)c(CC2CO2)c1CC1CO1

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
TP53 P04637 1/20 0.32
HBB P68871 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6924763 0.92 ALDH1A1 (0.32) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL132722 0.92 ALDH1A1 (0.35) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL7665254 0.89
SCHEMBL3180847 0.84
SCHEMBL11575280 0.83
SCHEMBL15400354 0.81
SCHEMBL9178335 0.79 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL912784 0.79 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL686767 0.79 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL142907 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109680505-B Surface modified aramid fiber and surface modification method and application thereof 中国石油化工股份有限公司 2022-05-27 CN claimed
CN-114395215-A Sulfone ether epoxy adhesive and UHMWPE fiber reinforced bulletproof composite material and preparation method thereof 兰溪聪普新材料有限公司 2022-04-26 CN claimed
WO-2023136269-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2023-07-20 WO disclosed
CN-111936564-B Prepreg and method for producing same 东丽株式会社 2022-12-20 CN disclosed
CN-114729133-A Method for molding fiber-reinforced composite material and epoxy resin composition used therein 东丽株式会社 2022-07-08 CN disclosed
CN-109680505-B Surface modified aramid fiber and surface modification method and application thereof 中国石油化工股份有限公司 2022-05-27 CN disclosed
CN-114395215-A Sulfone ether epoxy adhesive and UHMWPE fiber reinforced bulletproof composite material and preparation method thereof 兰溪聪普新材料有限公司 2022-04-26 CN disclosed
CN-106947079-B Modified polyimide, adhesive composition, copper foil with resin, copper-clad laminate, printed wiring board, and multilayer substrate 荒川化学工业株式会社 2021-08-03 CN disclosed
CN-106995678-B Polyimide adhesive 荒川化学工业株式会社 2021-01-15 CN disclosed
CN-112119537-A Phase modulation element and antenna 日产化学株式会社 2020-12-22 CN disclosed
CN-111989359-A Prepreg, laminate, fiber-reinforced composite material, and method for producing fiber-reinforced composite material 东丽株式会社 2020-11-24 CN disclosed
CN-111936564-A Prepreg and method for producing same 东丽株式会社 2020-11-13 CN disclosed
EP-0600512-B1 Curable and cured organosilicon compositions HERCULES INC (US) 2000-02-09 EP disclosed
US-5523374-A BLEND WITH EPOXY-FUNCTIONAL COMPOUNDS; CROSSLINKING HERCULES INCORPORATED (US) 1996-06-04 US disclosed
US-5391678-A Polymerizing a mixture of polyene, silicon compound or polysiloxane having at least two SiH groups and an epoxy compound; hydrosilation; mechanical properties; electronics; molding materials; composites; prepregs; adhesives; coatings HERCULES INCORPORATED (US) 1995-02-21 US disclosed
EP-0600512-A2 Curable and cured organosilicon compositions HERCULES INCORPORATED (US) 1994-06-08 EP disclosed