⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Thiosulfuric Acid SCHEMBL829132 | 1.00 | — | — | |
| Thiosulfuric Acid SCHEMBL924453 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL5145687 | 0.95 | CA5A (0.50) | — | |
| Thiosulfuric Acid SCHEMBL317415 | 0.95 | — | — | |
| Thiosulfuric Acid SCHEMBL28789875 | 0.90 | — | — | |
| Thiosulfuric Acid SCHEMBL7156517 | 0.90 | — | — | |
| Thiosulfuric Acid SCHEMBL828949 | 0.90 | — | — | |
| Thiosulfuric Acid SCHEMBL9501847 | 0.90 | CA5A (0.46) | — | |
| Thiosulfuric Acid SCHEMBL3697395 | 0.90 | — | — | |
| Thiosulfuric Acid SCHEMBL9104317 | 0.90 | CA5A (0.46) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | claimed |
| CN-115710701-A | Chemical gold plating solution and application | 广东东硕科技有限公司 | 2023-02-24 | — | — | CN | claimed |
| CN-115182007-A | Gold-palladium plating solution for electroplating copper wire and electroplating process | 上海万生合金材料有限公司 | 2022-10-14 | — | — | CN | claimed |
| CN-113005437-B | Chemical gold-precipitating liquid for printed circuit board | 深圳市创智成功科技有限公司 | 2021-12-24 | — | — | CN | claimed |
| US-11142826-B2 | Substitution-type electroless gold plating solution containing purine or pyrimidine-based compound having carbonyl oxygen and substitution-type electroless gold plating method using the same | MK CHEM & TECH CO., LTD (KR) | 2021-10-12 | — | — | US | claimed |
| CN-113005437-A | Chemical gold-precipitating liquid for printed circuit board | 深圳市创智成功科技有限公司 | 2021-06-22 | — | — | CN | claimed |
| US-20200095685-A1 | SUBSTITUTION-TYPE ELECTROLESS GOLD PLATING SOLUTION CONTAINING PURINE OR PYRIMIDINE-BASED COMPOUND HAVING CARBONYL OXYGEN AND SUBSTITUTION-TYPE ELECTROLESS GOLD PLATING METHOD USING THE SAME | MK CHEM & TECH CO., LTD (KR) | 2020-03-26 | — | — | US | claimed |
| CN-119194425-A | Electroless gold plating method and plating film substrate | 光华科学技术研究院(广东)有限公司 | 2024-12-27 | — | — | CN | disclosed |
| CN-115710701-B | Electroless gold plating solution and application | 广东东硕科技有限公司 | 2024-12-10 | — | — | CN | disclosed |
| US-11993862-B2 | Structure including copper plating layer or copper alloy plating layer | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-05-28 | — | — | US | disclosed |
| US-11946153-B2 | Copper or copper alloy electroplating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-04-02 | — | — | US | disclosed |
| CN-115710701-A | Chemical gold plating solution and application | 广东东硕科技有限公司 | 2023-02-24 | — | — | CN | disclosed |
| CN-115182007-A | Gold-palladium plating solution for electroplating copper wire and electroplating process | 上海万生合金材料有限公司 | 2022-10-14 | — | — | CN | disclosed |
| EP-0256858-B1 | RAPIDLY PROCESSABLE SILVER HALIDE PHOTOGRAPHIC LIGHT-SENSITIVE MATERIAL | KONICA CORPORATION (JP) | 1993-07-28 | — | — | EP | disclosed |
| EP-0285234-B1 | SILVER HALIDE PHOTOGRAPHIC LIGHT-SENSITIVE MATERIAL | KONICA CORPORATION (JP) | 1993-03-24 | — | — | EP | disclosed |
| US-4914016-A | CONTAINING SULFUR | KONICA CORPORATION (JP) | 1990-04-03 | — | — | US | disclosed |
| US-4839270-A | MOSTLY SILVER CHLORIDE GRAINS;STORAGE STABILITY, HIGH SENSITIVITY, LOW FOGGING | KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) | 1989-06-13 | — | — | US | disclosed |
| US-4830958-A | Silver halide photographic light-sensitive material which is excellent in rapid processability and has not very much sensitivity variation caused by a change on standing in the preparation of the light-sensitive material | KONICA CORPORATION (JP) | 1989-05-16 | — | — | US | disclosed |
| EP-0294149-A2 | Silver halide photographic light-sensitive material and processing method therefore | KONICA CORPORATION (JP) | 1988-12-07 | — | — | EP | disclosed |
| EP-0256858-A2 | Rapidly processable silver halide photographic light-sensitive material | KONICA CORPORATION (JP) | 1988-02-24 | — | — | EP | disclosed |