SCHEMBL14536633

SCHEMBL14536633

CCCc1cc2c(O)cccc2cc1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HMGCR P04035 1/20 0.49
GRIN2D O15399 1/20 0.42
GRIN2A Q12879 1/20 0.42
GRIN2B Q13224 1/20 0.42
GRIN2C Q14957 1/20 0.42
PLAU P00749 1/20 0.42
CTDSP1 Q9GZU7 1/20 0.42
CYP1A2 P05177 1/20 0.41
HSD17B1 P14061 3/20 0.40
HSD17B2 P37059 3/20 0.40
GPR84 Q9NQS5 1/20 0.40
ESR1 P03372 3/20 0.40
ESR2 Q92731 3/20 0.40
IAPP P10997 1/20 0.39
TRPM4 Q8TD43 1/20 0.38
ALOX5 P09917 1/20 0.38
DAO P14920 1/20 0.38
ELANE P08246 1/20 0.38
CTSG P08311 1/20 0.38
KDM4E B2RXH2 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31290149 0.91 GPR84 (0.44) HMGCRGRIN2DGRIN2AGRIN2BGRIN2C
SCHEMBL7045703 0.83 HSD17B1 (0.45) HMGCRGRIN2DGRIN2AGRIN2BGRIN2C
SCHEMBL20552943 0.81 HMGCR (0.55) HMGCRCYP1A2GPR84ESR1ESR2
SCHEMBL31290197 0.81 TYR (0.47) GRIN2DGRIN2AGRIN2BGRIN2CPLAU
SCHEMBL14898176 0.79 CYP1A2 (0.50) GRIN2DGRIN2AGRIN2BGRIN2CPLAU
SCHEMBL7046736 0.79 GRIN2D (0.50) GRIN2DGRIN2AGRIN2BGRIN2CPLAU
SCHEMBL7046826 0.75 HSD17B1 (0.47) GRIN2DGRIN2AGRIN2BGRIN2CPLAU
SCHEMBL5541800 0.75 CNR1 (0.52) PLAUCYP1A2HSD17B1HSD17B2ESR1
SCHEMBL7793914 0.74 GRIN2D (0.61) GRIN2DGRIN2AGRIN2BGRIN2CPLAU
SCHEMBL2115683 0.73 CYP1A2 (0.62) GRIN2DGRIN2AGRIN2BGRIN2CPLAU

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1785441-A1 EPOXY RESIN COMPOSITION, PRODUCTS OF CURING THEREOF, MATERIAL FOR THE ENCAPSULATION OF SEMICONDUCTORS, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, PROCESS FOR PRODUCTION OF NOVEL PHENOL RESIN AND PROCESS FOR PRODUCTION OF NOVEL EPOXY RESIN DAINIPPON INK AND CHEMICALS, INC. (JP) 2007-05-16 EP disclosed