SCHEMBL14562847

SCHEMBL14562847

CO[SiH](OC)C(C)CC1COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14562759 0.79 — —
SCHEMBL23091473 0.75 — —
SCHEMBL10136430 0.71 — —
SCHEMBL6677636 0.68 — —
SCHEMBL11734254 0.67 — —
SCHEMBL23091454 0.67 — —
SCHEMBL29920219 0.67 — —
SCHEMBL23091477 0.65 — —
SCHEMBL15669128 0.65 — —
SCHEMBL8460322 0.64 ALDH1A1 (0.44) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12434998-B2 Resin-coated ultra-thin glass TORAY INDUSTRIES, INC. (JP) 2025-10-07 — — US disclosed
US-20230365458-A1 RESIN-COATED ULTRA-THIN GLASS TORAY INDUSTRIES, INC. (JP) 2023-11-16 — — US disclosed
US-20210080829-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM TORAY INDUSTRIES, INC. (JP) 2021-03-18 — — US disclosed
US-9487627-B2 Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like LINTEC CORPORATION (JP) 2016-11-08 — — US disclosed
US-20150299396-A1 CURABLE POLYSILSESQUIOXANE COMPOUND, METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION OR THE LIKE LINTEC CORPORATION (JP) 2015-10-22 — — US disclosed
EP-2915834-A1 CURABLE POLYSILSESQUIOXANE COMPOUND, METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION OR LIKE Lintec Corporation (JP) 2015-09-09 — — EP disclosed
EP-2546306-B1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORP (JP) 2015-05-27 — — EP disclosed
US-8703880-B2 Curable composition, cured product, and method for using of curable composition LINTEC CORPORATION (JP) 2014-04-22 — — US disclosed
US-20130035455-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR USING OF CURABLE COMPOSITION LINTEC CORPORATION (JP) 2013-02-07 — — US disclosed
EP-2546306-A1 CURABLE COMPOSITION, HARDENED MATERIAL, AND METHOD FOR USING CURABLE COMPOSITION LINTEC Corporation (JP) 2013-01-16 — — EP disclosed
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