Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL623971 | 0.96 | — | — | |
| SCHEMBL358694 | 0.96 | ALDH1A1 (0.36) | ALDH1A1 | |
| SCHEMBL22129579 | 0.96 | ALDH1A1 (0.36) | ALDH1A1 | |
| SCHEMBL9307017 | 0.92 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL18239998 | 0.92 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL3957944 | 0.92 | ALDH1A1 (0.33) | ALDH1A1 | |
| SCHEMBL28452 | 0.91 | — | — | |
| SCHEMBL552393 | 0.91 | ALDH1A1 (0.39) | ALDH1A1 | |
| SCHEMBL3227368 | 0.88 | ALDH1A1 (0.31) | ALDH1A1 | |
| SCHEMBL6890483 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3642264-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | Momentive Performance Materials Inc. (US) | 2020-04-29 | — | — | EP | claimed |
| EP-3443027-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | Momentive Performance Materials Inc. (US) | 2019-02-20 | — | — | EP | claimed |
| WO-2018236679-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2018-12-27 | — | — | WO | claimed |
| WO-2017180329-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2017-10-19 | — | — | WO | claimed |
| JP-55085551-A | — | — | None | — | — | JP | disclosed |
| EP-3642264-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | Momentive Performance Materials Inc. (US) | 2020-04-29 | — | — | EP | disclosed |
| EP-3443027-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | Momentive Performance Materials Inc. (US) | 2019-02-20 | — | — | EP | disclosed |
| WO-2018236679-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2018-12-27 | — | — | WO | disclosed |
| WO-2017180329-A1 | CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2017-10-19 | — | — | WO | disclosed |
| EP-2891014-A1 | PATTERN FORMING METHOD, AND, ELECTRONIC DEVICE PRODUCING METHOD AND ELECTRONIC DEVICE, EACH USING THE SAME | FUJIFILM Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| EP-2761373-A1 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE | Fujifilm Corporation (JP) | 2014-08-06 | — | — | EP | disclosed |
| WO-2014034533-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE, AND COMPOUND | FUJIFILM CORPORATION (JP) | 2014-03-06 | — | — | WO | disclosed |
| EP-2356517-A2 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM Corporation (JP) | 2011-08-17 | — | — | EP | disclosed |
| EP-2338089-A1 | POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM Corporation (JP) | 2011-06-29 | — | — | EP | disclosed |
| WO-2011024734-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2011-03-03 | — | — | WO | disclosed |
| WO-2010114176-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION | FUJIFILM CORPORATION (JP) | 2010-10-07 | — | — | WO | disclosed |
| WO-2010067905-A2 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2010-06-17 | — | — | WO | disclosed |
| WO-2010035908-A1 | PATTERN FORMING METHOD | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | WO | disclosed |
| WO-2010035909-A1 | POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | WO | disclosed |
| JP-S5585551-A | NEW TRICYCLOUNDECANE AMINO ACID AMIDE | KAO CORP | 1980-06-27 | — | — | JP | disclosed |