SCHEMBL146255

SCHEMBL146255

[C]1[C]CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2233947 0.82
SCHEMBL2231357 0.82
SCHEMBL2232677 0.82
SCHEMBL2233919 0.82
SCHEMBL2233490 0.82
SCHEMBL2230228 0.82
SCHEMBL143009 0.79
SCHEMBL17911642 0.69
SCHEMBL330089 0.62
SCHEMBL3185118 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12044094-B2 Plug, downhole tool, and well treatment method KUREHA CORPORATION (JP) 2024-07-23 US disclosed
CN-117836369-A Curable composition, prepreg, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-04-05 CN disclosed
CN-117751173-A One-pack adhesive composition and cured product AGC株式会社 2024-03-22 CN disclosed
CN-117730131-A Two-component adhesive composition and cured product AGC株式会社 2024-03-19 CN disclosed
CN-117631451-A Colored photosensitive resin composition, color filter and image display device 东友精细化工有限公司 2024-03-01 CN disclosed
WO-2024043084-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
WO-2024043083-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2024-02-29 WO disclosed
CN-117467239-A Curable composition, cured product, optical member, and optical device 株式会社大赛璐 2024-01-30 CN disclosed
US-20230374880-A1 PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD KUREHA CORPORATION (JP) 2023-11-23 US disclosed
CN-116917411-A Molded body, downhole tool member, and downhole tool 株式会社吴羽 2023-10-20 CN disclosed
WO-2005044893-A1 CURABLE POLYESTER HAVING AN OXETANYL GROUP AT END AND PROCESS FOR PREPARING THE SAME, RESIST COMPOSITION, JET PRINTING INK COMPOSITION, CURING METHODS AND USES THEREOF SHOWA DENKO K.K. (JP) 2005-05-19 WO disclosed
EP-1513015-A1 Planographic printing plate material Konica Minolta Medical & Graphic, Inc. (JP) 2005-03-09 EP disclosed
US-20050048403-A1 Planographic printing plate material and planographic printing plate preparing process KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) 2005-03-03 US disclosed
US-20050037286-A1 Light sensitive composition, planographic printing plate material, and image formation method KONICA MINOLTA MEDICAL & GRAPHIC, INC. (JP) 2005-02-17 US disclosed
US-20040219459-A1 Producing method of photosensitive planographic printing plate and printing plate produced thereby KONICA MINOLTA MEDICAL & GRAPHIC INC. (JP) 2004-11-04 US disclosed
US-20040091816-A1 Photosensitive composition and photosensitive lithographic printing plate KONICA MINOLTA HOLDINGS, INC. (JP) 2004-05-13 US disclosed
EP-1413925-A2 Photosensitive composition and photosensitive lithographic printing plate KONICA MINOLTA HOLDINGS, INC. (JP) 2004-04-28 EP disclosed
US-20040005515-A1 Light sensitive planographic printing plate precursor and its processing method KONICA CORPORATION (JP) 2004-01-08 US disclosed
EP-1378793-A2 Light sensitive planographic printing plate precursor KONICA CORPORATION (JP) 2004-01-07 EP disclosed
US-5705664-A Mononoble metal dithiolates, preparations containing them and their use CERDEC AKTIENGESELLSCHAFT KERAMISCHE FARBEN (DE) 1998-01-06 US disclosed