⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2231357 | 1.00 | — | — | |
| SCHEMBL2233490 | 1.00 | — | — | |
| SCHEMBL2233919 | 1.00 | — | — | |
| SCHEMBL2232677 | 1.00 | — | — | |
| SCHEMBL2233947 | 1.00 | — | — | |
| SCHEMBL146255 | 0.82 | — | — | |
| SCHEMBL143009 | 0.74 | — | — | |
| SCHEMBL16534583 | 0.67 | — | — | |
| SCHEMBL585520 | 0.67 | — | — | |
| SCHEMBL62295 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12044094-B2 | Plug, downhole tool, and well treatment method | KUREHA CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| CN-117916314-A | Resin composition, downhole tool or component thereof, plug, and well treatment method | 株式会社吴羽 | 2024-04-19 | — | — | CN | disclosed |
| US-20240117102-A1 | POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-11 | — | — | US | disclosed |
| US-20240117101-A1 | COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2024-04-11 | — | — | US | disclosed |
| CN-117836369-A | Curable composition, prepreg, metal foil-clad laminate, and printed wiring board | 三菱瓦斯化学株式会社 | 2024-04-05 | — | — | CN | disclosed |
| WO-2024043084-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| WO-2024043083-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| US-20230374880-A1 | PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD | KUREHA CORPORATION (JP) | 2023-11-23 | — | — | US | disclosed |
| US-20230314942-A1 | POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-05 | — | — | US | disclosed |
| US-20230296982-A1 | POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-09-21 | — | — | US | disclosed |
| US-20130005875-A1 | RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2013-01-03 | — | — | US | disclosed |
| EP-2530111-A1 | FILM | Teijin Limited (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-20120302676-A1 | FILM | TEIJIN LIMITED (JP) | 2012-11-29 | — | — | US | disclosed |
| US-20120289625-A1 | POLYLACTIC ACID COMPOSITION | TEIJIN LIMITED (JP) | 2012-11-15 | — | — | US | disclosed |
| EP-2479320-A1 | FIBER AND FIBER STRUCTURE | Teijin Limited (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20120184166-A1 | FIBER AND FIBER STRUCTURE | TEIJIN LIMITED (JP) | 2012-07-19 | — | — | US | disclosed |
| EP-2374833-A1 | METHOD FOR USING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-10-12 | — | — | EP | disclosed |
| US-20110237755-A1 | METHOD OF USING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-29 | — | — | US | disclosed |
| US-20110224385-A1 | RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-15 | — | — | US | disclosed |
| EP-2360208-A1 | RESIN COMPOSITION CONTAINING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-08-24 | — | — | EP | disclosed |