⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2231357 | 1.00 | — | — | |
| SCHEMBL2233490 | 1.00 | — | — | |
| SCHEMBL2233919 | 1.00 | — | — | |
| SCHEMBL2232677 | 1.00 | — | — | |
| SCHEMBL2230228 | 1.00 | — | — | |
| SCHEMBL146255 | 0.82 | — | — | |
| SCHEMBL143009 | 0.74 | — | — | |
| SCHEMBL16534583 | 0.67 | — | — | |
| SCHEMBL585520 | 0.67 | — | — | |
| SCHEMBL62295 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12044094-B2 | Plug, downhole tool, and well treatment method | KUREHA CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| WO-2024043084-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| WO-2024043083-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD | パナソニックＩＰマネジメント株式会社 | 2024-02-29 | — | — | WO | disclosed |
| US-20230374880-A1 | PLUG, DOWNHOLE TOOL, AND WELL TREATMENT METHOD | KUREHA CORPORATION (JP) | 2023-11-23 | — | — | US | disclosed |
| EP-4227355-A1 | PLUG, DOWNHOLE TOOL, AND WELL TREATING METHOD | Kureha Corporation (JP) | 2023-08-16 | — | — | EP | disclosed |
| US-11702504-B2 | Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-07-18 | — | — | US | disclosed |
| US-20230192989-A1 | POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR | KUREHA CORPORATION (JP) | 2023-06-22 | — | — | US | disclosed |
| EP-4163321-A1 | POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR | Kureha Corporation (JP) | 2023-04-12 | — | — | EP | disclosed |
| WO-2023053955-A1 | RESIN COMPOSITION, DOWNHOLE TOOL OR MEMBER THEREOF, PLUG, AND WELL TREATMENT METHOD | 株式会社クレハ | 2023-04-06 | — | — | WO | disclosed |
| WO-2023013717-A1 | CURABLE COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2023-02-09 | — | — | WO | disclosed |
| US-20130005875-A1 | RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2013-01-03 | — | — | US | disclosed |
| EP-2530111-A1 | FILM | Teijin Limited (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-20120302676-A1 | FILM | TEIJIN LIMITED (JP) | 2012-11-29 | — | — | US | disclosed |
| US-20120289625-A1 | POLYLACTIC ACID COMPOSITION | TEIJIN LIMITED (JP) | 2012-11-15 | — | — | US | disclosed |
| EP-2479320-A1 | FIBER AND FIBER STRUCTURE | Teijin Limited (JP) | 2012-07-25 | — | — | EP | disclosed |
| US-20120184166-A1 | FIBER AND FIBER STRUCTURE | TEIJIN LIMITED (JP) | 2012-07-19 | — | — | US | disclosed |
| EP-2374833-A1 | METHOD FOR USING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-10-12 | — | — | EP | disclosed |
| US-20110237755-A1 | METHOD OF USING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-29 | — | — | US | disclosed |
| US-20110224385-A1 | RESIN COMPOSITION COMPRISING A CYCLIC CARBODIIMIDE | TEIJIN LIMITED (JP) | 2011-09-15 | — | — | US | disclosed |
| EP-2360208-A1 | RESIN COMPOSITION CONTAINING CYCLIC CARBODIMIDE | Teijin Limited (JP) | 2011-08-24 | — | — | EP | disclosed |