SCHEMBL1467428

SCHEMBL1467428

C=COCCC[Si](C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL961889 0.94
SCHEMBL7627457 0.88
SCHEMBL8171391 0.85 HPGD (0.32)
SCHEMBL9757072 0.83
SCHEMBL581055 0.82
SCHEMBL22418831 0.80
SCHEMBL961202 0.79
SCHEMBL3893274 0.79 ALDH1A1 (0.30)
SCHEMBL9001441 0.78
SCHEMBL13007306 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4653500-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM Kyoeisha Chemical Co., Ltd. (JP) 2025-11-26 EP disclosed
US-20250270418-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM KYOEISHA CHEMICAL CO., LTD. (JP) 2025-08-28 US disclosed
US-20250011480-A1 CURABLE RESIN COMPOSITION KYOEISHA CHEMICAL CO., LTD. (JP) 2025-01-09 US disclosed
WO-2024189996-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM 共栄社化学株式会社 2024-09-19 WO disclosed
EP-4414426-A1 CURABLE RESIN COMPOSITION Kyoeisha Chemical Co., Ltd. (JP) 2024-08-14 EP disclosed
CN-114728306-B Thermosetting resin composition, cured film, method for forming multilayer coating film, ester compound, and polymer 共荣社化学株式会社 2024-06-14 CN disclosed
CN-118019808-A Curable resin composition 共荣社化学株式会社 2024-05-10 CN disclosed
CN-113646347-B Aqueous thermosetting resin composition and cured film 共荣社化学株式会社 2023-05-23 CN disclosed
WO-2023080228-A1 CURABLE RESIN COMPOSITION 共栄社化学株式会社 2023-05-11 WO disclosed
US-20230110863-A1 THERMOSETTING RESIN COMPOSITION AND TRANSESTERIFICATION REACTION CATALYST KYOEISHA CHEMICAL CO., LTD. (JP) 2023-04-13 US disclosed
EP-1162247-A2 Coating composition, coating method, and coated article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-12 EP disclosed
US-20010036986-A1 Coating composition, coating method, and coated article KABUSHIKI KAISHA TOYODA JIDOSHOKKI SEISAKUSHO (JP) 2001-11-01 US disclosed
EP-1122278-A2 Coating composition, coating method, and coated article SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-08 EP disclosed
EP-1070750-A2 Coating compositions and method for the surface protection of plastic substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-01-24 EP disclosed
EP-1036834-A1 ULTRAVIOLET-ABSORBING LAMINATED RESINOUS MATERIAL Nippon Shokubai Co., Ltd. (JP) 2000-09-20 EP disclosed
US-6037394-A ACRYLIC RESIN, BENZOTRIAZOLE, SOLVENT, AND ALKOXYSILANE REACTION PRODUCT WITH SILYLATION AGENT; PROTECTIVE COATINGS, WEAR RESISTANCE, WEATHERPROOFING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-03-14 US disclosed
EP-0934987-A1 Primer composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-08-11 EP disclosed
US-5025049-A Organic copolymer containing alkoxysilylated monomer, polyalkyl (meth) acrylate, crosslinking agent and ultraviolet absorber SHIN-ETSU CHEMICAL CO., LTD. (JP) 1991-06-18 US disclosed
US-5021266-A Silicon based protective coating SHIN-ETSU CHEMICAL CO., LTD. (JP) 1991-06-04 US disclosed
US-4960809-A CURABLE MIXTURE OF ALKOXYSILYL-CONTAINING ADDITION COPOLYMER AND AN AMIDATED POLYMER OF AN AMINE-CONTAINING ALKOXYSILANE AND SILYLATING AGENT; ADHESION TO SILICONE OVERCOATINGS AND POLYCARBONATE SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 1990-10-02 US disclosed