⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL771880 | 0.95 | — | — | |
| SCHEMBL24425403 | 0.95 | — | — | |
| SCHEMBL653175 | 0.84 | — | — | |
| SCHEMBL24425411 | 0.78 | — | — | |
| SCHEMBL12821075 | 0.76 | — | — | |
| SCHEMBL18963350 | 0.73 | — | — | |
| SCHEMBL23922185 | 0.71 | — | — | |
| SCHEMBL24425438 | 0.70 | — | — | |
| SCHEMBL11425255 | 0.70 | — | — | |
| SCHEMBL24425437 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120057904-A | Halogen and nitrogen element co-doped graphene composite material loading metal active site, hydrogen evolution electrode, preparation method and application | 上海交通大学 | 2025-05-30 | — | — | CN | claimed |
| CN-115850011-A | Fully deuterated cis-1, 2,3, 4-tetrafluorocyclopentane and preparation method thereof | 湖北工业大学 | 2023-03-28 | — | — | CN | claimed |
| CN-115466601-B | Fluorine-containing electronic cooling liquid | 北京宇极科技发展有限公司 | 2023-03-24 | — | — | CN | claimed |
| CN-115466601-A | Fluorine-containing electronic cooling liquid | 北京宇极科技发展有限公司 | 2022-12-13 | — | — | CN | claimed |
| US-20250343048-A1 | ETCHING METHOD | RESONAC CORPORATION (JP) | 2025-11-06 | — | — | US | disclosed |
| CN-120057904-A | Halogen and nitrogen element co-doped graphene composite material loading metal active site, hydrogen evolution electrode, preparation method and application | 上海交通大学 | 2025-05-30 | — | — | CN | disclosed |
| EP-4481794-A1 | ETCHING METHOD | Resonac Corporation (JP) | 2024-12-25 | — | — | EP | disclosed |
| CN-118679554-A | Etching method | 株式会社力森诺科 | 2024-09-20 | — | — | CN | disclosed |
| WO-2023157441-A1 | ETCHING METHOD | 株式会社レゾナック | 2023-08-24 | — | — | WO | disclosed |
| CN-115850011-A | Fully deuterated cis-1, 2,3, 4-tetrafluorocyclopentane and preparation method thereof | 湖北工业大学 | 2023-03-28 | — | — | CN | disclosed |
| CN-115850011-A | Fully deuterated cis-1, 2,3, 4-tetrafluorocyclopentane and preparation method thereof | 湖北工业大学 | 2023-03-28 | — | — | CN | disclosed |
| CN-115850011-A | Fully deuterated cis-1, 2,3, 4-tetrafluorocyclopentane and preparation method thereof | 湖北工业大学 | 2023-03-28 | — | — | CN | disclosed |
| CN-115466601-B | Fluorine-containing electronic cooling liquid | 北京宇极科技发展有限公司 | 2023-03-24 | — | — | CN | disclosed |
| CN-115466601-A | Fluorine-containing electronic cooling liquid | 北京宇极科技发展有限公司 | 2022-12-13 | — | — | CN | disclosed |
| US-20110068086-A1 | PLASMA ETCHING METHOD | ZEON CORPORATION (JP) | 2011-03-24 | — | — | US | disclosed |