Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HMGB1 | P09429 | 1/20 | 0.38 |
| ▸ | FOLH1 | Q04609 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 2/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | CLCN2 | P51788 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.35 |
| ▸ | FABP4 | P15090 | 4/20 | 0.35 |
| ▸ | FABP3 | P05413 | 1/20 | 0.34 |
| ▸ | GFER | P55789 | 1/20 | 0.34 |
| ▸ | SIRT1 | Q96EB6 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27592093 | 0.90 | ALDH1A1 (0.41) | HMGB1ALDH1A1ALOX15HPGDHSD17B10 | |
| SCHEMBL230422 | 0.89 | DHFR (0.33) | ALDH1A1TSHR | |
| SCHEMBL10782556 | 0.86 | PARP1 (0.37) | ALDH1A1ALOX15HPGDHSD17B10KDM4E | |
| SCHEMBL28799560 | 0.85 | AKR1C3 (0.41) | ALDH1A1 | |
| SCHEMBL2289368 | 0.85 | FOLH1 (0.49) | HMGB1FOLH1ALDH1A1ALOX15HPGD | |
| SCHEMBL23628577 | 0.84 | HMGB1 (0.53) | HMGB1FOLH1ALDH1A1ALOX15HPGD | |
| SCHEMBL3896645 | 0.84 | FOLH1 (0.41) | HMGB1FOLH1ALDH1A1ALOX15HPGD | |
| SCHEMBL216109 | 0.83 | CYP1A2 (0.39) | ALDH1A1ALOX15TSHRCYP1A2 | |
| SCHEMBL8846948 | 0.83 | TSHR (0.47) | ALDH1A1HPGDHSD17B10KDM4ETSHR | |
| SCHEMBL8847300 | 0.83 | TSHR (0.47) | HMGB1FOLH1ALDH1A1ALOX15HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116606531-A | Resin composition for molding material, and molded article | DIC株式会社 | 2023-08-18 | — | — | CN | disclosed |
| CN-216437596-U | Multi-chip packaging structure | 广东佛智芯微电子技术研究有限公司 | 2022-05-03 | — | — | CN | disclosed |
| CN-114121680-A | Multi-chip three-dimensional packaging structure and packaging method | 广东佛智芯微电子技术研究有限公司 | 2022-03-01 | — | — | CN | disclosed |
| CN-114079431-A | Large-board-level fan-out filter packaging method and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2022-02-22 | — | — | CN | disclosed |
| CN-112466857-B | Chip packaging method based on light-transmitting plate and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2021-06-25 | — | — | CN | disclosed |
| CN-213546307-U | Partitioned heat dissipation chip packaging structure | 广东佛智芯微电子技术研究有限公司 | 2021-06-25 | — | — | CN | disclosed |
| CN-112953430-A | Filter packaging method based on glass substrate and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2021-06-11 | — | — | CN | disclosed |
| CN-112928028-A | Board-level chip packaging method with embedded circuit and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2021-06-08 | — | — | CN | disclosed |
| CN-112466857-A | Chip packaging method based on light-transmitting plate and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2021-03-09 | — | — | CN | disclosed |
| CN-112366142-A | Chip packaging method and chip packaging structure for reducing lead bonding height | 广东佛智芯微电子技术研究有限公司 | 2021-02-12 | — | — | CN | disclosed |
| CN-207624733-U | OLED encapsulation film structure and the structure for using its encapsulation OLED | 武汉市三选科技有限公司 | 2018-07-17 | — | — | CN | disclosed |
| CN-106995584-A | The preparation of capactive film constituent and capactive film and the capactive film and method for packing | 武汉市三选科技有限公司 | 2017-08-01 | — | — | CN | disclosed |
| CN-106905550-A | OLED encapsulation film and its manufacture method and the encapsulation OLED methods using the film | 武汉市三选科技有限公司 | 2017-06-30 | — | — | CN | disclosed |
| CN-106751529-A | Dielectric polymer composites film composition high, capactive film and preparation method thereof and method for packing | 武汉市三选科技有限公司 | 2017-05-31 | — | — | CN | disclosed |
| CN-103748129-B | Polyepoxide and epoxy resin and the method for preparing and using it | 沙特基础全球技术有限公司 | 2016-06-29 | — | — | CN | disclosed |
| US-20150197597-A1 | POLYEPOXIDES AND EPOXY RESINS AND METHODS FOR THE MANUFACTURE AND USE THEREOF | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2015-07-16 | — | — | US | disclosed |
| EP-2748221-A1 | POLYEPOXIDES AND EPOXY RESINS AND METHODS FOR THE MANUFACTURE AND USE THEREOF | SABIC Innovative Plastics IP B.V. (NL) | 2014-07-02 | — | — | EP | disclosed |
| CN-103748129-A | Polyepoxides and epoxy resins and methods for the manufacture and use thereof | SABIC INNOVATIVE PLASTICS IP | 2014-04-23 | — | — | CN | disclosed |
| US-20130052381-A1 | POLYEPOXIDES AND EPOXY RESINS AND METHODS FOR THE MANUFACTURE AND USE THEREOF | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2013-02-28 | — | — | US | disclosed |
| WO-2013028607-A1 | POLYEPOXIDES AND EPOXY RESINS AND METHODS FOR THE MANUFACTURE AND USE THEREOF | SABIC INNOVATIVE PLASTICS IP B.V. (NL) | 2013-02-28 | — | — | WO | disclosed |