Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.51 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27991514 | 0.95 | TSHR (0.55) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL2397982 | 0.86 | TSHR (0.53) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL5815970 | 0.85 | SMN1; SMN2 (0.50) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL9230609 | 0.82 | TSHR (0.55) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL28065 | 0.81 | TSHR (0.64) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL8461230 | 0.81 | TSHR (0.55) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL2918735 | 0.81 | TSHR (0.58) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL23706428 | 0.80 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL23706437 | 0.80 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL23706411 | 0.80 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3410468-B1 | N-TYPE SEMICONDUCTOR ELEMENT, COMPLEMENTARY TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND WIRELESS COMMUNICATION DEVICE IN WHICH THE SAME IS USED | TORAY INDUSTRIES (JP) | 2024-07-10 | — | — | EP | disclosed |
| EP-3382751-B1 | FERROELECTRIC MEMORY ELEMENT, METHOD FOR PRODUCING SAME, MEMORY CELL USING FERROELECTRIC MEMORY ELEMENT, AND RADIO COMMUNICATION DEVICE USING FERROELECTRIC MEMORY ELEMENT | TORAY INDUSTRIES (JP) | 2023-09-13 | — | — | EP | disclosed |
| EP-3514822-B1 | METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE | TORAY INDUSTRIES (JP) | 2023-04-26 | — | — | EP | disclosed |
| US-11616453-B2 | Integrated circuit, method for manufacturing same, and radio communication device using same | TORAY INDUSTRIES, INC. (JP) | 2023-03-28 | — | — | US | disclosed |
| EP-3706166-B1 | INTEGRATED CIRCUIT, METHOD FOR MANUFACTURING SAME, AND RADIO COMMUNICATION DEVICE USING SAME | TORAY INDUSTRIES (JP) | 2023-02-08 | — | — | EP | disclosed |
| US-11094899-B2 | Method for manufacturing field effect transistor and method for manufacturing wireless communication device | TORAY INDUSTRIES, INC. | 2021-08-17 | — | — | US | disclosed |
| EP-3367402-B1 | CAPACITOR, METHOD FOR MANUFACTURING SAME, AND WIRELESS COMMUNICATION DEVICE USING SAME | TORAY INDUSTRIES (JP) | 2021-07-07 | — | — | EP | disclosed |
| EP-3208295-B1 | METHOD FOR PRODUCING SILOXANE RESIN | KANEKA CORP (JP) | 2021-01-13 | — | — | EP | disclosed |
| EP-3706166-A1 | INTEGRATED CIRCUIT, METHOD FOR MANUFACTURING SAME, AND RADIO COMMUNICATION DEVICE USING SAME | Toray Industries, Inc. (JP) | 2020-09-09 | — | — | EP | disclosed |
| US-20200244182-A1 | INTEGRATED CIRCUIT, METHOD FOR MANUFACTURING SAME, AND RADIO COMMUNICATION DEVICE USING SAME | TORAY INDUSTRIES, INC. (JP) | 2020-07-30 | — | — | US | disclosed |
| US-9048445-B2 | Gate insulating material, gate insulating film and organic field-effect transistor | TORAY INDUSTRIES, INC. (JP) | 2015-06-02 | — | — | US | disclosed |
| WO-2014030772-A1 | ADHESIVE FOR LAMINATED SHEETS | HENKEL JAPAN LTD. (JP) | 2014-02-27 | — | — | WO | disclosed |
| WO-2013180301-A1 | ADHESIVE FOR LAMINATED SHEETS | HENKEL JAPAN LTD. (JP) | 2013-12-05 | — | — | WO | disclosed |
| WO-2013180252-A1 | ADHESIVE FOR LAMINATED SHEETS | HENKEL JAPAN LTD. (JP) | 2013-12-05 | — | — | WO | disclosed |
| US-20110068417-A1 | GATE INSULATING MATERIAL, GATE INSULATING FILM AND ORGANIC FIELD-EFFECT TRANSISTOR | TORAY INDUSTRIES, INC. (JP) | 2011-03-24 | — | — | US | disclosed |
| EP-2259289-A1 | GATE INSULATING MATERIAL, GATE INSULATING FILM, AND ORGANIC FIELD EFFECT TRANSISTOR | Toray Industries, Inc. (JP) | 2010-12-08 | — | — | EP | disclosed |
| US-6177138-B1 | FOR HARD COATS WITH ADHESION AND ABRASION RESISTANCE; FOR COATING PLASTIC LENSES | NIPPON ARC CO., LTD. (JP) | 2001-01-23 | — | — | US | disclosed |
| EP-0976801-A1 | MARRING-RESISTANT COATING COMPOSITION FOR MOLDED ACRYLIC RESIN | NIPPON ARC CO., LTD. (JP) | 2000-02-02 | — | — | EP | disclosed |
| US-6001907-A | Latex sealants containing epoxysilanes | WITCO CORPORATION (US) | 1999-12-14 | — | — | US | disclosed |
| EP-0924250-A1 | Latex sealants containing epoxysilanes | WITCO CORPORATION (US) | 1999-06-23 | — | — | EP | disclosed |