Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.53 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.51 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26915646 | 0.84 | TSHR (0.58) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL391887 | 0.81 | ALDH1A1 (0.68) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL3843910 | 0.81 | TSHR (0.64) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL7210717 | 0.81 | TSHR (0.64) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL28561105 | 0.81 | SMN1; SMN2 (0.79) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL1472176 | 0.81 | TSHR (0.58) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL4808081 | 0.80 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL10704138 | 0.80 | ALDH1A1 (0.71) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL7197388 | 0.80 | TSHR (0.62) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 | |
| SCHEMBL4808338 | 0.79 | TSHR (0.60) | TSHRALDH1A1TDP1SMN1; SMN2MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105934478-B | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | 日立化成株式会社 | 2020-01-14 | — | — | CN | claimed |
| US-20240101763-A1 | COMPOSITION COMPRISING ORGANIC FUNCTIONAL ALKOXYSILANES AND COATING COMPOSITIONS COMPRISING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. | 2024-03-28 | — | — | US | disclosed |
| CN-117580908-A | Curable composition, cured product, coating agent, and concrete structure | 株式会社钟化 | 2024-02-20 | — | — | CN | disclosed |
| EP-4288497-A1 | COMPOSITION COMPRISING ORGANIC FUNCTIONAL ALKOXYSILANES AND COATING COMPOSITIONS COMPRISING THE SAME | Momentive Performance Materials Inc. (US) | 2023-12-13 | — | — | EP | disclosed |
| WO-2022169744-A1 | COMPOSITION COMPRISING ORGANIC FUNCTIONAL ALKOXYSILANES AND COATING COMPOSITIONS COMPRISING THE SAME | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-08-11 | — | — | WO | disclosed |
| CN-110168033-B | Photocatalyst coating set | 盛势达技研株式会社 | 2022-03-29 | — | — | CN | disclosed |
| CN-113508161-A | Polymer blend, composition, sealant, and sealant for tire | 株式会社钟化 | 2021-10-15 | — | — | CN | disclosed |
| CN-108475642-B | n-type semiconductor element and complementary semiconductor device, method of manufacturing the same, and wireless communication apparatus using the same | 东丽株式会社 | 2021-07-27 | — | — | CN | disclosed |
| CN-113031427-A | Timepiece and method for manufacturing windshield of timepiece | 西铁城时计株式会社 | 2021-06-25 | — | — | CN | disclosed |
| CN-112789323-A | Resin composition, cured product, and semiconductor device | 昭和电工材料株式会社 | 2021-05-11 | — | — | CN | disclosed |
| CN-105934478-B | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | 日立化成株式会社 | 2020-01-14 | — | — | CN | disclosed |
| CN-107111004-B | UV-curable coating composition for obtaining improved abrasion resistance | 依视路国际公司 | 2020-01-03 | — | — | CN | disclosed |
| CN-110615884-A | Adhesive for laminated sheet | 汉高股份有限及两合公司 | 2019-12-27 | — | — | CN | disclosed |
| EP-1289677-B1 | WATER-BASED PRIMER FOR PROMOTING ADHESION OF POLYURETHANE-BASED SEALANTS AND ADHESIVES | SIKA TECHNOLOGY AG (CH) | 2010-09-01 | — | — | EP | disclosed |
| EP-1289677-A4 | WATER-BASED PRIMER FOR PROMOTING ADHESION OF POLYURETHANE-BASED SEALANTS AND ADHESIVES | SIKA CORP (US) | 2003-11-05 | — | — | EP | disclosed |
| EP-1289677-A1 | WATER-BASED PRIMER FOR PROMOTING ADHESION OF POLYURETHANE-BASED SEALANTS AND ADHESIVES | Sika Corporation (US) | 2003-03-12 | — | — | EP | disclosed |
| US-6511752-B1 | Using such as isopropyltri(n-ethylenediamino)ethyltitanate and 3-glycidoxypropyltrimethoxysilane which react with both polymer and float glass or ceramic frit substrate; storage stability; little or no volatile organic emissions | SIKA CORPORATION | 2003-01-28 | — | — | US | disclosed |
| WO-2001091923-A1 | WATER-BASED PRIMER FOR PROMOTING ADHESION OF POLYURETHANE-BASED SEALANTS AND ADHESIVES | SIKA CORPORATION (US) | 2001-12-06 | — | — | WO | disclosed |
| US-6001907-A | Latex sealants containing epoxysilanes | WITCO CORPORATION (US) | 1999-12-14 | — | — | US | disclosed |
| EP-0924250-A1 | Latex sealants containing epoxysilanes | WITCO CORPORATION (US) | 1999-06-23 | — | — | EP | disclosed |